Key Responsibilities:
- Lead the co-design of silicon and package, focusing on DDR PHY and mixed signal IP integration for server SOCs.
- Design bump maps, floor plans, and manage area constraints for PHYs, collaborating closely with packaging technical experts.
- Conduct hands-onpackage extractionsand simulations(signal integrity, power integrity)
- Finalize bump-out, floor plan, and area decisions at the end of tech readiness phases.
- Interface with packaging teams on advanced technologies (e.g., C4 bumps, micro bumps, EMIB, hybrid bonding as needed).
- Focus on design, development, and architecture, not process or materials engineering.
Required Experience:
- Experience in both silicon design (preferably mixed signal/analog) and packaging co-design.
- Background in DDR, SOC, or similar high-speed interface development.
- Hands-on expertise with bump mapping, floor planning, and packaging constraints.
- Proven ability to collaborate across silicon and packaging teams, including risk assessment and simulation.
- Familiarity with advanced packaging technologies (hybrid bonding, EMIB, etc.) is a plus but not required.
- Individual contributor or principal engineer level preferred; management experience is not required.
- Experience at leading companies in advanced packaging and PHY design (e.g., Apple, Broadcom, Qualcomm, Micron, AMD, Nvidia).
Qualifications:- Bachelors in electrical engineering, chemical engineering, mechanical engineering, material science or similar field (Master’s or Ph.D. preferred).
- 10+ years in silicon and packaging co-design
Experienced HireShift 1 (United States of America)US, California, FolsomUS, Arizona, Phoenix, US, California, Santa Clara, US, Oregon, Hillsboro
Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.
Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
Annual Salary Range for jobs which could be performed in the US: