Intel Silicon Packaging Architect 

United States, Arizona, Phoenix 

876184698

Responsibilities

• Define Package Architecture across Intel's product portfolios (CPUs, Chipsets, SOC designs and more) as part of the Assembly and Test Technology Development group.
• Work with the Si and Board design teams to define and implement a co-design strategy which would optimize product performance and cost at the package and system level.
• Understand packaging technology development FMEAs and product packaging requirements - both physical and electrical.
• Work closely with Intel and external customers on advanced design nodes to establish design flows for advanced package architectures.
• Direct technical aspects of the Package Architecture process including conducting early route studies, creation of specifications, providing guidance for electrical analysis and supervision of production layouts.
• Collaborate with EDA partners on advancing package design tools and identify most efficient design methods and serve as the technical expert on advanced package architectures and design tools as well as consult on design and implementation issues.
• Work with a cross functional team including silicon IP design, package and PCB platform to define and co-optimize package solutions. This position determines creative design approaches and solutions based on formal education and judgement, works with the design and layout teams to implement those solutions.

Required Background and Experience:

• Good technical understanding in the areas of Si +Package - Board interaction.
• Solid background in semiconductor fabrication and packaging
• Self-motivated engineer who has strong technical background in both design and electrical analysis.
• Experience with design and simulation tools.
• Strong analytical ability and problem-solving skills: identifying, isolating, and debugging issues and providing creative solutions. - Ability to work independently and at various levels of abstraction
• Strong organization, time management, and communication skills, self-motivated.
• Exhibit the following behavioral traits:
  • Strong analytical ability and problem-solving skills like identifying, isolating, and debugging issues and providing creative solutions.
  • Ability to work independently and at various levels of abstraction.

Qualifications:

Required Qualifications:

• US Citizenship required.
• Ability to obtain a US Government Security Clearance
• Ph.D. or master’s in electrical engineering, chemical engineering, mechanical engineering, material science or similar field.
• 10+ years and in-depth knowledge/background in Package, PCB design, or IC digital design.

Preferred Qualifications:

• Active US Government Security Clearance with a minimal of a Secret Level.
• Experience and knowledge with assembly process, test and characterization techniques.

Experienced HireShift 1 (United States of America)US, Arizona, Phoenix
Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

Annual Salary Range for jobs which could be performed in the US:

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.