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Intel Silicon Packaging Architect Malaysia, Penang 5072824
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Job Description:
- Translates product requirements into package architecture specification, drives end-to-end package solutions for physical, electrical, and cost requirements.
- Leads technology tradeoff decisions ensuring silicon packages conform to electrical, mechanical, thermal, and reliability standards, specifications, and landing zones.
- Collaborates with silicon, hardware, and package leads to ensure high quality package output and aids in removing roadblocks.
- Oversees end-to-end package development process, including design, processes, and procedures and continuously improves packaging quality standards and targets.
- Applies expertise in package design troubleshooting, resolves new and existing packaging problems involving designs, materials, and processes and provides innovative and cost-effective solutions.
- Collaborates with manufacturing team to ensure the packaging design and tape-out seamlessly transition to production.
- Bachelor Degree in relevant engineering/science domain with minimum 10 years of experience in the package design and/or architecture.
- Prior leadership role in package technology readiness development, design tape-out and/or innovation.
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