Amazon Senior Product Engineer Kuiper Silicon Team 

United States, Washington 

59260158

The Role:
As Senior Product Engineer, you will engage with an experienced cross-disciplinary staff to develop, support, and manufacture innovative semiconductor solutions for Kuiper’s satellite and ground terminal products. You will work closely with internal inter-disciplinary teams and third-party suppliers to drive key aspects of semiconductor product manufacturing, test, qualification, and reliability to meet our customers’ needs. You must be responsive, flexible and able to succeed within an open collaborative peer environment.Export Control RequirementKey job responsibilities
 Analyze foundry WAT data from development, corner lots and qual lots.
 Define char plans and corner lots, and then oversee execution of char data collection and analysis at outsource partner.
 Analyze bench-ATE correlation data and implement appropriate offsets / transforms.
 Complete char data guardbanding and finalize test program limits with appropriate guardbands and confirm compliance to system specs. Drive test-time reduction by RF-DC and FT-WS correlation and reject-oriented analysis.
 Define qual plans based on evaluation of mission profile and execute to defined qual plans.
 Define test plans and limits for production lots, corners lots, and pre-/post-qualification lots based on system specs, and yield & Cpk targets.
 Identify root cause and drive fixes for any failures reported during qual.

- Bachelor's degree in electrical/communications engineering or related field, or equivalent experience.
- 7+ years in semiconductor product engineering or foundry process operations, preferably in high-volume wireless SoC devices manufacturing.
- Up to 20% domestic or international travel required.

- Masters or PhD degree in Electrical, Chemical, Materials Engineering or related field.
- Excellent oral and written communications skills.- Strong technical background in one or more of the following:- Proficiency in statistics, data analysis and YMS products such as Exensio and JMP – scripting skills preferred.
- Strong understanding of product-test, process-product, package-product and chip-package interactions.
- RFIC product development and characterization experience.
- Experience with digital and Serdes testing.
- Experience interfacing with suppliers and external partners.
- High volume production ramp of SOCs.
- Proficiency in failure analysis techniques such as FIB, SEM, IR, EMMI, and CSAM.
- Knowledgeable with package technologies such as FCBGA, FCCSP, WLCSP, and QFN.