Amazon Senior Product Engineer Kuiper Silicon Team 

United States, Washington 

36132138

The Role:
As Senior Product Engineer, you will engage with an experienced cross-disciplinary staff to develop, support, and manufacture innovative semiconductor solutions for Kuiper’s satellite and ground terminal products. You will work closely with internal inter-disciplinary teams and third-party suppliers to drive key aspects of semiconductor product manufacturing, test, qualification, and reliability to meet our customers’ needs. You must be responsive, flexible and able to succeed within an open collaborative peer environment.Export Control RequirementKey job responsibilities
- Analyze wafer sort and FT data in production flow through tools such as Exensio and JMP.
- Identify yield hitters and define / execute plans for improving yield.
- Utilize yield signatures to identify and address pro-actively potential reliability problems.- Support debug failing devices from ATE, qual and RMAs on bench for SoCs, including for digital, RF, analog and Serdes blocks and extract fault localizations. Drive corrective actions at supplier based on PFA findings.
- Drive optimization of foundry process targeting to balance yield performance across all product blocks to maximize yield response.- Drive qualification and verify matching for 2nd source suppliers at assy and test.
- Drive test-time reduction by RF-DC and FT-WS correlation and reject-oriented analysis and drive yield loss from FT to WS to reduce cost of goods sold.
- Periodic review and report Cpk performance across key datasheet parameters and report across products in production, with actions defined / executed to improve low Cpk items.
- Identify root cause and drive fixes for any failures reported during qual.

- Bachelor's degree in electrical/communications engineering or related field, or equivalent experience.
- 7+ years in semiconductor product engineering or foundry process operations, preferably in high-volume wireless SoC devices manufacturing.
- Up to 20% domestic or international travel required.

- Masters or PhD degree in Electrical, Chemical, Materials Engineering or related field.
- Excellent oral and written communications skills.- Strong technical background in one or more of the following:- Proficiency in statistics, data analysis and YMS products such as Exensio and JMP – scripting skills preferred.
- Strong understanding of product-test, process-product, package-product and chip-package interactions.
- RFIC product development and characterization experience.
- Experience with digital and Serdes testing.
- Experience interfacing with suppliers and external partners.
- High volume production ramp of SOCs.
- Proficiency in failure analysis techniques such as FIB, SEM, IR, EMMI, and CSAM.
- Knowledgeable with package technologies such as FCBGA, FCCSP, WLCSP, and QFN.