Numerical mechanical simulation of advanced IC packages chip-to-packaging interaction and packaging-to-system interaction to provide design guidance for yield and reliability. Perform first-principles analysis for component warpage, stress-strain for 2.5D/3D package...
Work with manufacturers on component development and lead resolutions to achieve mass production. Lead material characterization and process corner studies with suppliers. Spearhead Root cause analysis and permanent countermeasures with...
Numerical mechanical simulation of advanced IC packages chip-to-packaging interaction and packaging-to-system interaction to provide design guidance for yield and reliability. Perform first-principles analysis for component warpage, stress-strain for 2.5D/3D package...