מציאת משרת הייטק בחברות הטובות ביותר מעולם לא הייתה קלה יותר
דרושים Packaging ב-United States, California, Palo Alto
ממשו את הפוטנציאל שלכם בתעשיית ההייטק עם אקספוינט! חפשו הזדמנויות עבודה בתור Packaging בUnited States, California, Palo Alto והצטרפו לעוד אלפים שכבר מצאו עבודה בחברות המובילות. התחילו את המסע שלכם עוד היום ומצאו את הקריירה האידיאלית עבורכם בתור Packaging עם אקספוינט.
חברה
אופי המשרה
קטגוריות תפקיד
שם תפקיד (1)
United States
California
Palo Alto
נמצאו 2 משרות
16.04.2025
T
Tesla Staff IC Packaging Mechanical Engineer Dojo United States, California, Palo Alto
Numerical mechanical simulation of advanced IC packages chip-to-packaging interaction and packaging-to-system interaction to provide design guidance for yield and reliability. Perform first-principles analysis for component warpage, stress-strain for 2.5D/3D package...
תיאור:
What You’ll Do What You’ll Bring
- Numerical mechanical simulation of advanced IC packages chip-to-packaging interaction and packaging-to-system interaction to provide design guidance for yield and reliability
- Perform first-principles analysis for component warpage, stress-strain for 2.5D/3D package materials, solder joint reliability, stacked via etc.
- Model and simulate manufacturing and assembly process for conventional and advance packaging process, die to substrate joint process, underfill flow and curing process, package to board SMT process
- Conduct first-order packaging thermal and mold flow analysis to optimize structural design
- Packaging materials characterization to support new packaging architecture and materials selection using TMA, DMA, nanoindentation, lap shear, DSC, TGA etc. and applying adequate material models to precisely describe physical behavior
- Degree or equivalent with 5+ year experience in IC packaging mechanical/material engineering or related fields
- Strong hands-on experience of major FEM tools(e.g., ANSYS, ABAQUS, etc.)
- Deep understanding of packaging materials, mechanical characterization and qualification methodology
- Knowledgeable of advanced packaging technology, e.g fan-out, SoC&HBM integration HPC packaging, 3D IC structural concept
- Excellent engineering problem solving skills with strong physics and fundamentals
- Nice to have programming experience using Matlab, Python and fundamental machine learning capability
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משרות נוספות שיכולות לעניין אותך
16.04.2025
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Tesla Supplier Industrialization Engineer IC Packaging United States, California, Palo Alto
Work with manufacturers on component development and lead resolutions to achieve mass production. Lead material characterization and process corner studies with suppliers. Spearhead Root cause analysis and permanent countermeasures with...
תיאור:
What You’ll Do What You’ll Bring
- Work with manufacturers on component development and lead resolutions to achieve mass production
- Lead material characterization and process corner studies with suppliers
- Spearhead Root cause analysis and permanent countermeasures with the manufacturer, cross functional team of engineers, GSMs and QE with appropriate mitigation strategies
- Work cross functionally with design and reliability engineering team, to ensure package can meet the design requirements
- Work with OSATs to bring packaging solution from concept to production
- Monitor the supplier’s yield very minutely and take appropriate actions to predict and resolve excursions
- Audit, assess and oversee equipment performance & monitor implemented process controls at several suppliers
- Assess Supplier’s PFMEA and manufacturing process controls and drive continuous improvement
- Monitor Supplier Production Capacity (Operations management)
- Owner of RFQ's and contract management - ensure Non-Disclosure Agreements, General Terms & Conditions, Piece Price Agreements, and other related contracts are negotiated, agreed and appropriately documented before business is initiated
- Degree or equivalent experience in Electrical Engineering, Material Science, Physics, etc.
- Understands Statistical Process Control, demonstrates experience of enhancing SPC programs and has solid knowledge of statistical analysis
- Has experience of failure analysis and material analysis techniques – SEM/EDX, TEM, XRF, XRD, CSAM, spectrum analyzer, and etc.
- Detailed understanding of JEDEC, AEC-Q, RoHS and IPC and other such standards/requirements
- Has experience with NPI activities for high volume manufacturing
- Understands applications of Cpk, GR&Rs and process qualification methodologies
- Experience with PPAP
- Domestic and international travel (expected 25% of the time) is required to engage with suppliers, sometimes on short notice
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משרות נוספות שיכולות לעניין אותך
Numerical mechanical simulation of advanced IC packages chip-to-packaging interaction and packaging-to-system interaction to provide design guidance for yield and reliability. Perform first-principles analysis for component warpage, stress-strain for 2.5D/3D package...
תיאור:
What You’ll Do What You’ll Bring
- Numerical mechanical simulation of advanced IC packages chip-to-packaging interaction and packaging-to-system interaction to provide design guidance for yield and reliability
- Perform first-principles analysis for component warpage, stress-strain for 2.5D/3D package materials, solder joint reliability, stacked via etc.
- Model and simulate manufacturing and assembly process for conventional and advance packaging process, die to substrate joint process, underfill flow and curing process, package to board SMT process
- Conduct first-order packaging thermal and mold flow analysis to optimize structural design
- Packaging materials characterization to support new packaging architecture and materials selection using TMA, DMA, nanoindentation, lap shear, DSC, TGA etc. and applying adequate material models to precisely describe physical behavior
- Degree or equivalent with 5+ year experience in IC packaging mechanical/material engineering or related fields
- Strong hands-on experience of major FEM tools(e.g., ANSYS, ABAQUS, etc.)
- Deep understanding of packaging materials, mechanical characterization and qualification methodology
- Knowledgeable of advanced packaging technology, e.g fan-out, SoC&HBM integration HPC packaging, 3D IC structural concept
- Excellent engineering problem solving skills with strong physics and fundamentals
- Nice to have programming experience using Matlab, Python and fundamental machine learning capability
Show more
משרות נוספות שיכולות לעניין אותך
תכננו את מהלך הקריירה הבא שלכם בתעשיית ההייטק עם אקספוינט! הפלטפורמה שלנו מציעה מגוון רחב של משרות Packaging באזור United States, California, Palo Alto, ומעניקה לכם גישה לחברות הטובות ביותר בתחום. בין אם אתם מחפשים אתגר חדש או שינוי נוף, אקספוינט תקל על מציאת התאמת העבודה המושלמת עבורכם. עם מנוע החיפוש הקל לשימוש שלנו, תוכלו למצוא במהירות הזדמנויות עבודה ולחבור לחברות מובילות. הירשמו היום ועשו את הצעד הבא בקריירת ההיי-טק שלכם עם Expoint.