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Tesla IC Package Process Engineer Dojo United States, California, Palo Alto 7381293
13.08.2024
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What to ExpectWhat You’ll DoWhat You’ll Bring
In this highly visible role, you will be responsible for assembly process for advanced IC package including pathfinding, development and high volume manufacturing.
- Work with cross-functional groups at Tesla and lead SoC packaging assembly process integration at Tesla
- Explore and drive industry on advance semiconductor packaging technology development for new leading-edge products
- Work with OSATs vendors to bring advanced packaging solutions from concept to high volume manufacturing
- Bachelor's Degree in a relevant field, or equivalent experience
- 2+ year experience in semiconductor packaging technology, design and manufacturing process, or the equivalent in experience and evidence of exceptional ability
- Expert knowledge in 2D/2.5D/3D packaging technology development and qualification
- Solid experience in advanced packaging assembly processes and failure analysis
- Excellent engineering problem solving skills with strong physics and fundamentals
- Excellent communication skills to work well with internal, cross functional teams and overseas suppliers
- Optical module integration experience is a strong plus
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