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Tesla Staff IC Packaging Mechanical Engineer Dojo United States, California, Palo Alto 238663787
13.08.2024
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What to Expect What You’ll Do What You’ll Bring
In this highly visible role, you will be responsible for mechanical simulation and materials characterization of advanced IC packaging. You will drive packaging design for manufacturing and reliability, and product level qualification.
- Numerical mechanical simulation of advanced IC packages chip-to-packaging interaction and packaging-to-system interaction to provide design guidance for yield and reliability
- Perform first-principles analysis for component warpage, stress-strain for 2.5D/3D package materials, solder joint reliability, stacked via etc.
- Model and simulate manufacturing and assembly process for conventional and advance packaging process, die to substrate joint process, underfill flow and curing process, package to board SMT process
- Conduct first-order packaging thermal and mold flow analysis to optimize structural design
- Packaging materials characterization to support new packaging architecture and materials selection using TMA, DMA, nanoindentation, lap shear, DSC, TGA etc and applying adequate material models to precisely describe physical behavior
- Master's Degree or equivalent with 5+ year experience in IC packaging mechanical/material engineering or related fields
- Strong hands-on experience of major FEM tools(e.g., ANSYS, ABAQUS, etc.)
- Deep understanding of packaging materials, mechanical characterization and qualification methodology
- Knowledgeable of advanced packaging technology, e.g fan-out, SoC&HBM integration HPC packaging, 3D IC structural concept
- Excellent engineering problem solving skills with strong physics and fundamentals
- Nice to have programming experience using Matlab, Python and fundamental machine learning capability
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