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Tesla Staff IC Packaging Mechanical Engineer Dojo United States, California, Palo Alto 238663787
16.04.2025
What You’ll Do What You’ll Bring
- Numerical mechanical simulation of advanced IC packages chip-to-packaging interaction and packaging-to-system interaction to provide design guidance for yield and reliability
- Perform first-principles analysis for component warpage, stress-strain for 2.5D/3D package materials, solder joint reliability, stacked via etc.
- Model and simulate manufacturing and assembly process for conventional and advance packaging process, die to substrate joint process, underfill flow and curing process, package to board SMT process
- Conduct first-order packaging thermal and mold flow analysis to optimize structural design
- Packaging materials characterization to support new packaging architecture and materials selection using TMA, DMA, nanoindentation, lap shear, DSC, TGA etc. and applying adequate material models to precisely describe physical behavior
- Degree or equivalent with 5+ year experience in IC packaging mechanical/material engineering or related fields
- Strong hands-on experience of major FEM tools(e.g., ANSYS, ABAQUS, etc.)
- Deep understanding of packaging materials, mechanical characterization and qualification methodology
- Knowledgeable of advanced packaging technology, e.g fan-out, SoC&HBM integration HPC packaging, 3D IC structural concept
- Excellent engineering problem solving skills with strong physics and fundamentals
- Nice to have programming experience using Matlab, Python and fundamental machine learning capability
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