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Tesla IC Package Process Engineer Dojo 
United States, California, Palo Alto 
7381293

Yesterday
What You’ll Do
  • Work with cross-functional groups at Tesla and lead SoC packaging assembly process integration at Tesla
  • Explore and drive industry on advance semiconductor packaging technology development for new leading-edge products
  • Work with OSATs vendors to bring advanced packaging solutions from concept to high volume manufacturing
What You’ll Bring
  • Bachelor's Degree in a relevant field, or equivalent experience
  • 2+ year experience in semiconductor packaging technology, design and manufacturing process, or the equivalent in experience and evidence of exceptional ability
  • Expert knowledge in 2D/2.5D/3D packaging technology development and qualification
  • Solid experience in advanced packaging assembly processes and failure analysis
  • Excellent engineering problem solving skills with strong physics and fundamentals
  • Excellent communication skills to work well with internal, cross functional teams and overseas suppliers
  • Optical module integration experience is a strong plus