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Tesla IC Package Process Engineer Dojo United States, California, Palo Alto 7381293
13.08.2024
What to ExpectWhat You’ll DoWhat You’ll Bring
In this highly visible role, you will be responsible for assembly process for advanced IC package including pathfinding, development and high volume manufacturing.
- Work with cross-functional groups at Tesla and lead SoC packaging assembly process integration at Tesla
- Explore and drive industry on advance semiconductor packaging technology development for new leading-edge products
- Work with OSATs vendors to bring advanced packaging solutions from concept to high volume manufacturing
- Bachelor's Degree in a relevant field, or equivalent experience
- 2+ year experience in semiconductor packaging technology, design and manufacturing process, or the equivalent in experience and evidence of exceptional ability
- Expert knowledge in 2D/2.5D/3D packaging technology development and qualification
- Solid experience in advanced packaging assembly processes and failure analysis
- Excellent engineering problem solving skills with strong physics and fundamentals
- Excellent communication skills to work well with internal, cross functional teams and overseas suppliers
- Optical module integration experience is a strong plus
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