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Apple IC Packaging Characterization Engineer United States, California, San Diego 796908843
02.05.2024
Key Qualifications
- BS and 3+ years of relevant industry experience.
- Proficiency with major mechanical design CAD tools, such as Siemens NX, AutoCAD, SpaceClaim, SolidWorks, etc.
- Proven capability of setting up equipment and data acquisition systems.
- Hands-on experience of major material analysis and failure analysis tools (e.g., SEM, EDX, FIB, CSAM, etc.) is helpful.
- Knowledge of the Integrated Circuit packaging process, reliability, qualification requirements, and key materials is a plus.
- Excellent written and verbal communication skills with ability to present ideas, data, and plans with high confidence at team meetings.
Description
- Characterizing component packages under various environmental and reliability testing conditions, such as mechanical loading, thermal and moisture stressing.- Characterizing key packaging materials and supervising material characterization activities at suppliers.- Developing characterization methodologies for IC packages and related materials, including setting up equipment and building proper fixtures for the test.- Working on trouble-shooting activities of packaging-related failures.
Education & Experience
- BS and 3+ years of relevant industry experience.
Pay & Benefits
- At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $131,500.00 and $243,300.00, and your base pay will depend on your skills, qualifications, experience, and location.Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
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