Texas Instruments Manufacturing Product Engineer LFAB 

United States, Utah, Lehi 

436553165

Responsibilities include:

• Yield Optimization: Conduct thorough analysis of production yield issues to identify root causes and implement corrective actions that enhance product performance and manufacturing efficiency.
• New Product Launch: Collaborate with Business Units to characterize, qualify, and successfully release new products to production, ensuring a smooth transition from design to manufacturing.
• Production Support: Address daily production challenges including low yield disposition and process troubleshooting.
• Continuous Improvement: Lead initiatives focused on productivity, cost reduction, and quality enhancement across the production process.
• Data-Driven Insights: Utilize statistical tools and production data to guide engineering decisions and process improvements.
• Design Collaboration: Work with design teams on product simulation, design verification and silicon debug.
• Cross-functional Collaboration: Liaise with business units' product engineering teams to drive yield improvements through test program optimization, hardware enhancements, and setup adjustments.

Minimum requirements:

• Master's degree in Electrical & Computer Engineering, Electrical Engineering, or related engineering degree
• Minimum of 5 years of experience in a product engineering role within the semiconductor industry.
• Strong analytical skills and experience with yield analysis and manufacturing data.
• Proficiency in tools such as JMP, Excel, and statistical analysis software.
• Excellent communication and collaboration skills.
• Ability to work independently and in cross-functional teams.

Preferred qualifications:

• Expertise in analog/mixed-signal circuit design, analysis, and verification, including experience with Operational Amplifiers (OP Amps), Analog-to-Digital Converters (ADCs), Digital-to-Analog Converters (DACs), and Radio Frequency (RF) circuits
• Experience with digital logic design and verification, including Automatic Test Pattern Generation (ATPG) and scan chain design and implementation
• Knowledge of memory design and architecture, including Static Random-Access Memory (SRAM) and Flash memory
• In-depth knowledge of semiconductor manufacturing processes, including fabrication, assembly, and test
• Strong foundation in device physics and circuit theory
• Excellent collaboration and teamwork skills, with ability to work effectively across modules
• Proven ability to drive results, prioritize tasks, and manage time to meet project deadlines
• Adaptability and resilience in a fast-paced, dynamic environment with multiple priorities and interruptions
• Strong interpersonal and influencing skills, with ability to build effective relationships and communicate with diverse stakeholders
• Exceptional problem-solving skills, with attention to detail and ability to think creatively
• Effective communication and presentation skills, with ability to articulate complex technical concepts to both technical and non-technical audiences
• Strategic thinking and ability to navigate complex, high-pressure situations with poise and professionalism