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Architectural Leadership:
Lead the architectural definition and integration of high-speed PHYs for client SoCs, including PCIe, CXL, USBx (e.g., eUSB2, USB3, USB4), Display, MIPI (D-PHY, C-PHY, M-PHY), Ethernet, and TSN.
Collaborate with platform and product architects to analyze requirements and define critical performance, power, and area specifications to ensure the success of our products.
IP Evaluation:
Conduct technical evaluations of both internal and external PHY IPs, analyzing their performance characteristics against product requirements, and ensuring strategic alignment with overall product goals.
Define detailed IP requirements, lead vendor engagement, and make strategic IP selection recommendations based on technical feasibility, cost-effectiveness, and long-term roadmap alignment.
Technology Vision:
Proactively research and evaluate emerging high-speed I/O technologies, industry trends, and evolving standards.
Identify and champion opportunities to incorporate these advancements into our product roadmap, enhancing performance, power efficiency, and feature sets, and positioning our products for competitive advantage.
Technical Documentation:
Create clear and comprehensive architecture specifications and rigorous integration guidelines.
Provide review and constructive feedback on related architectural specifications to ensure alignment with overall SoC goals.
Technical Mentorship and Collaboration:
Provide technical guidance and mentoring to junior engineers, fostering their growth and contributing to the overall team expertise.
Champion a collaborative environment across multiple teams.
Post-Silicon Leadership:
Serve as a technical lead in the post-silicon debug and validation of high-speed I/O interfaces, leading taskforces and driving the resolution of complex issues.
Oversee the validation process to ensure seamless and high-quality implementations.
Additional Skills
Demonstrated strategic acumen with proven effectiveness in collaborating with senior technologists and business leaders across organizational boundaries.
Demonstrated ability to network with and influence a broad range of stakeholders
Strong technical leadership and communication skills
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Master's with 8+ years of experience in Electrical/Computer Engineering or related field or BS with 12+ years of experience in Electrical/Computer Engineering or related field
12+ years of SerDes experience
Prior hands-on experience in High-Speed IO PHY Architecture and Design.
Strong knowledge in the interoperability of HSIO PHYs within the PCIe, SATA, Ethernet, USB2, USB3, USB4, Display or MIPI IO Controller subsystems
High familiarity with Industry trends within the HSIO domain and ability to map them to Intel roadmap/products and segment strategies
offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
Annual Salary Range for jobs which could be performed in the US:
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