Qualcomm Package/System Design Engineer Senior 

United States, California, San Diego 

250587545

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

Job responsibilities for this position include package selection, package design, and package EE modeling. This involves optimizing system co-design of IC-PKG-PCB die keeping in mind package footprint/height constraints, IC floor-planning, PCB, high-speed signal integrity, power distribution network, and thermal constraints.

Additional responsibilities:

• IC top level floor planning including hard macro block placement, padring, RDL and bump pattern/assignment

• System level co-design methodology of IC, Package and PCB/Board

• Concept analysis for new product package selection based on requirements for mechanical, thermal and electrical performance with the goal to achieve lowest system level cost

• Package design flow methodology implementing high speed interface SI constraints for jitter, IR drop, cross-talk, and SSN specs

• Package design flow methodology implementing power distribution network (PDN) constraints for high speed processor cores (1GHz+) including design optimization techniques at the die/pkg/PCB levels

• Working with marketing/IC/product teams on competitive analysis and road mapping package technology for future products

Minimum Qualifications:

• Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.

• 2+ years Hardware Engineering experience or related work experience.

This is an office-based position located in San Diego, CA.

Preferred Qualifications:

• Working knowledge of IC package and/or PCB selection, design , and layout experience - Experience in Pinmap optimization of optimal PCB design

• Working knowledge of die floor planning, IO placement, and bump placement

• Working knowledge of Chip, Package and PCB co-design methodology

• Experience with high speed SerDes and DDR layout process

• Experience in IO + PKG + PCB SI/PI modeling, co-simulation and analysis

• Experience in 3D/2D EM simulation tool, electromagnetic theory and transmission line theory

• Experience or knowledge in PCB design process like Schematic capture

• Familiar with assembly and substrate manufacturing process

• Familiar with trade-offs among package cost, technologies, design, performance, power, and thermal requirements.

• Familiar with PCB stack-up and breakout strategy

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Pay range:

$115,500.00 - $173,500.00