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Apple IC Package Design Engineer United States, California, San Diego 951010628
30.03.2024
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Key Qualifications
- Hands-on experience with package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools.
- Solid fundamentals in electrical/material/thermal/mechanical engineering field.
- Familiarity with various sophisticated package configurations and assembly / substrate technology (wirebond, POP, etc.).
- SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters and RLGC model.
- Substrate manufacturing process, structure, design rules and material property.
- Solid understanding of high-speed interfaces, including DDR, PCIe, NAND, etc.
- Exposure to Unix environment, scripting languages (PERL, Python, TCL and or shell) and methodology.
- Good understanding of system specification and IC design, ability to work with design teams to translate IC / system requirement into package / SIP configuration.
- Consistent track record to drive package selection through feasibility studies and drive chip Floor planning and bump assignment.
- Preferred Experience:
- Familiar with package design reviews and familiarity with CAM350/Valor or Calibre and CAD.
- Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs, EMI/RFI, PCB/package resonance).
- Design experience with RFIC and 5G packages, SIP or module schematic and layout design. Hands-on knowledge of Design Rules Check and Design for Manufacturing.
- Experience with TSV, 2D/2.5D and 3D package connection.
- Familiar with Cadence Concept HDL for schematic review, experience in schematic capture and system integration.
Description
- Implement the physical design of packages and modules for SoC, Memory, RF and cellular chips. - Define and develop design verification and automation strategy to strengthen and streamline package design and release flows. - Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution. - Interface and coordinate with cross-functional groups throughout Apple on new product package/SiP/module feasibility analysis, design and selection. - Ensure package design is optimized with SI/PI requirements. - Explore, evaluate and develop new CAD tool, design and verification flow. - Collaborate in multi-functional discussions for package architecture and technology roadmap (partner with Silicon PD team to optimize chip Floorplan and bump placement and minimize package size/build positive relationships with the Systems team for optimizing package pin out). - Identify and drive cost saving opportunities and/or performance enhancing features. - Perform extraction of S-parameters and package RLGC model.
Education & Experience
- BS and 10+ years of relevant industry experience.
Pay & Benefits
- At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $161,700.00 and $284,900.00, and your base pay will depend on your skills, qualifications, experience, and location.Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
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