- Implement the physical design of packages and modules for SoC, Memory, RF and cellular chips. - Define and develop design verification and automation strategy to strengthen and streamline package design and release flows. - Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution. - Interface and coordinate with cross-functional groups throughout Apple on new product package/SiP/module feasibility analysis, design and selection. - Ensure package design is optimized with SI/PI requirements. - Explore, evaluate and develop new CAD tool, design and verification flow. - Collaborate in multi-functional discussions for package architecture and technology roadmap (partner with Silicon PD team to optimize chip Floorplan and bump placement and minimize package size/build positive relationships with the Systems team for optimizing package pin out). - Identify and drive cost saving opportunities and/or performance enhancing features. - Perform extraction of S-parameters and package RLGC model.