- Implement the physical design of packages and modules for SoC, Memory, RF and cellular chips. - Interface and coordinate with multi-functional groups throughout Apple on new product package/SiP/module feasibility analysis, design and selection. - Define and develop design verification and automation strategy to strengthen and streamline package design as well as release flows.- Work multi-functionally to optimize package pin out. - Perform extraction of S-parameters and package RLGC model. - Ensure package design is optimized with SI/PI requirements.- Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution.- Explore, evaluate and develop new CAD tool, design and verification flow. - Partner with Silicon PD team to optimize chip Floorplan and bump placement, and minimize package size.