Nvidia Senior Package Design Engineer 

United States, California 

29116888

What you'll be doing:

• Your responsibilities will include defining the chip pad ring, substrate interconnect scheme, and lead the package layout design process for package test vehicles

• The focus will be primarily on flip chip and 2.5D interposer based packages

• Implementelectrical/mechanical/thermalstructures in test vehicles for effective package technology evaluations

• Develop design flow for new package technologies

• Collaborate with cross functional teams to incorporate various requirements in package designs

• Work with off-shore fab and package assembly manufacturing partners to develop and implement package design rules

What we need to see:

• BS in EE or ME (or equivalent experience)

• 6+ years package design experience

• Strong programming skills (Perl, Python, Tcl desired)

• Working knowledge of Cadence Allegro Packaging Design (APD)

• Experience in 2.5D packages

• Strong problem solving skills