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Apple Design Manufacturing DFM Engineer - PCBA India, Karnataka, Bengaluru 81930069
06.06.2024
Description
- Key responsibilities will include:- Attend development builds as required under direction of Operations Engineering Directly Responsible Individual (DRI). - May provide guidance and resources to contract manufacturing (CM) partner engineers.- Acts as project leader on a variety of complex projects.- Plans, develops and implements technically complex procedures for PCBA manufacturing process, rework, and testing. - Make recommendations for changes required in testing equipment (ICT and Functional test), manufacturing processes, and new testing requirements.- Designs and develops technically complex new processes to improve quality and efficiency.- Provides early manufacturing involvement to ensure new products are manufacturable. Activities include driving out costs in design/PCBA manufacturing tooling, influencing designs so that they are manufacturable, reducing complexity by using standard size packaging.
Key Qualifications
- 5+ years of experience in printed circuit assembly manufacturing processes.
- Surface mount technology process knowledge including stencil printing, pick and placement process, reflow process, hotbar, robotic/laser soldering and ACF process.
- Experience developing process quality plans, supplier quality audits, and driving corrective actions and failure analysis efforts.
- Working knowledge of printed circuit board assembly (PCBA) reliability concepts, failure analysis techniques like EDX, SEM and FTIR.
- Experience with the development and evaluation of various SMT processes
- Project management experience and a deep understanding of problem solving tools including design of experiments, root cause analysis and statistical analytical tools
- Experience with any of the following: packaging technology, chip scale or wafer level chip scale packaging technology, molding process, System in package construction
- Effective communication skills with an ability to explain complex problems to a wide variety of technical and non-technical audiences
- Good team player with an ability to work with multiple x-functional teams
Education & Experience
BS/MS in Mechanical, Electrical, Industrial, Chemical or Manufacturing Engineering with 5 to 6 years experience working in Printed circuit board assembly or with surface mount technology at a contract manufacturer or any related experience.Apple benefits programmes vary by country and are subject to eligibility requirements.
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