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IBM Hardware Developer - Process Integration Engineer United States, New York, City of Albany 254980769
Yesterday
IBM Research at Albany, NY is seeking a process integration engineer who will push boundaries in the integration of advanced logic and next generation semiconductor packaging technologies. In this role, you will be responsible for the integration of processes that span the back end of the line (BEOL) silicon semiconductor processing, wafer finishing, and grindside processing. You will have a critical role in the development of 2.x and 3D silicon technologies and beyond. The position requires interaction with cross-functional and multi-company working teams that include engineers engaged in unit process development, materials and process development, structural/chemical/electrical analysis, and layout design.
1) Bachelor’s degree in a science or engineering discipline
2) Understanding of semiconductor fabrication processes and tools.
3) Hands on experience in the back end of the line (BEOL) process integration covering Copper interconnects and dual damascene integration flow.
4) Experience with interpreting failure analysis from structural and chemical characterization techniques.
5) Experience with design of experiments, process controls, and statistical data analysis.
1) MS/PhD degree in a science or engineering discipline.
2) 3+ years hands on experience in one or more of these areas: thru silicon via (TSV) process integration, hybrid bonding, temporary bonding-debonding, bumping, wafer level fan out, semiconductor packaging technology.
3) Experience or knowledge in performing quantitative analysis of electrical data to interpret experimental results.
4) Understanding of semiconductor reliability analysis and failure mechanisms.
5) Excellent written and verbal communication skills, and the ability to articulate difficult concepts to an audience with diverse technical backgrounds.
1) Bachelor’s degree in a science or engineering discipline
2) Understanding of semiconductor fabrication processes and tools.
3) Hands on experience in the back end of the line (BEOL) process integration covering Copper interconnects and dual damascene integration flow.
4) Experience with interpreting failure analysis from structural and chemical characterization techniques.
5) Experience with design of experiments, process controls, and statistical data analysis.
1) MS/PhD degree in a science or engineering discipline.
2) 3+ years hands on experience in one or more of these areas: thru silicon via (TSV) process integration, hybrid bonding, temporary bonding-debonding, bumping, wafer level fan out, semiconductor packaging technology.
3) Experience or knowledge in performing quantitative analysis of electrical data to interpret experimental results.
4) Understanding of semiconductor reliability analysis and failure mechanisms.
5) Excellent written and verbal communication skills, and the ability to articulate difficult concepts to an audience with diverse technical backgrounds.
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