Vlsi Timing Methodology Intern - Summer jobs at Nvidia

What you’ll be doing:

• Develop and test sample applications for chemistry and materials discovery using artificial intelligence.

• Help develop AI first workflows using NVIDIA technology and popular deep learning frameworks.

• Create clear, practical examples and documentation for developers and researchers.

What we need to see:

• Pursuing a PhD in Chemistry, Materials Science, Computer Science, or a related field.

• Familiarity with AI/ML concepts and experience with at least one deep learning framework (e.g., PyTorch, TensorFlow).

• Basic understanding of chemistry or materials science principles.

Ways to stand out from the crowd:

• Experience with GPU programming or CUDA and machine learning frameworks such as PyTorch.

• Contributions to open-source projects related to AI or scientific computing.

• Coursework or projects involving AI for scientific applications.

You will also be eligible for Intern

What you'll be doing:

• As a senior member in our team, you will work with pre-silicon and post-silicon data analytics - visualization, insights and modeling.

• Design and uphold sturdy data pipelines and ETL processes for the ingestion and processing of DFX Engineering data from various origins

• Lead engineering efforts by collaborating with cross-functional teams (execution, analytics, data science, product) to define data requirements and ensure data quality and consistency

• You will work on hard-to-solve problems in the Design For Test space which will involve application of algorithm design, using statistical tools to analyze and interpret complex datasets and explorations using Applied AI methods.

• In addition, you will help develop and deploy DFT methodologies for our next generation products using Gen AI solutions.

• You will also help mentor junior engineers on test designs and trade-offs including cost and quality.

What we need to see:

• BSEE (or equivalent experience) with 5+, MSEE with 3+, or PhD with 1+ years of experience in low-power DFT, Data Visualization, Applied Machine Learning or Database Management.

• Experience with SQL, ETL, and data modeling is crucial

• Hands-on experience with cloud platforms (AWS, Azure, GCP)

• Design and implement highly scalable, fault tolerant distributed database solutions

• Lead data modeling, performance tuning, and capacity planning for large-scale, mission-critical storage workloads

• Excellent knowledge in using statistical tools for data analysis & insights.

• Strong programming and scripting skills in Perl, Python, C++ or Tcl is expected

• Outstanding written and oral communication skills with the curiosity to work on rare challenges.

Ways to stand out from the crowd:

• Experience in data pipeline and database architecture for real-world systems

• Experience in application of AI for EDA-related problem-solving

• Good understanding of technology and passionate about what you do

• Strong collaborative and interpersonal skills, specifically a proven ability to effectively guide and influence within a dynamic environment

What you’ll be doing:

• Develop methods, execute performance tests, and analyze data for IC components and board-level product certifications.

• Participate in research and development of novel IC qualification processes.

• Review and interpret equipment manuals, schematics, and technical documents to support equipment setup, calibration, and installation.

• Assist engineers with analysis tasks, including equipment setup, sample preparation, basic thermal/power characterization, and troubleshooting of test equipment.

• Support reliability lab operations by contributing to test requirement assessments, metrology design/optimization, and mechanical fixture assembly/debug.

• Prepare and deliver project updates and lessons learned to the team.

What we need to see:

• Currently pursuing a masters degree in Materials Science, Mechanical Engineering, or a related field.

• Knowledge with IC packaging, reliability testing, and semiconductor technologies.

• Knowledge withpackaging/test/failureanalysis lab equipment is a plus.

• Knowledge of CAD/SolidWorks or similar design software is desirable.

• Strong problem-solving skills, attention to detail, and ability to work both independently and collaboratively.

• Excellent communication skills, with the ability to document and present technical findings clearly.

Ways to stand out from the crowd:

• Knowledge in IC packaging and physics of failure

• Experience in high power testing, such as Hipot, SIR, ECM

• Experience in image processing

You will also be eligible for Intern

We need aSystem Fault Isolation Internwith expertise in physics, process andpackage technologies,

What you'll be doing:

• Gain experience in debugging product failures at the die, package, component, and board level

• Develop a working understanding of EFA and PFA techniques and tools including curvetracing, Electro-OpticalTerahertz Pulse Reflectometry (EOTPR), Vector Network Analyzer (VNA), Scanning Acoustic Microscopy (SAM), X-ray Computed Tomography (CT), Laser Voltage Probing (LVP),Optical/Electron/AtomicForce Microscopy, andUltra-thinning/delayeringand cross sectioning sample preparation techniques

• Build knowledge surrounding the interactions between process technology, physical design, and circuit design

• Develop innovations to help enhance the capability and efficiency of FA processes

What you need to have:

• Pursuing a Bachelors or Masters degree in Electrical/Computer Engineering, Chemical Engineering, Materials Science/Engineering, Physics, or other related field

• Lab experience with electrical and materials characterization tools

• Experience in one or more areas across silicon process technology, VLSI design, and FA tools such as Curve Tracer, SEM, Lock-in Thermography, Pulse Reflectometry, LVP, etc.

• Excellent communication skills and teamwork both cross-functionally and between companies

Ways to stand out from the crowd:

• Practical experience in silicon technology and/or design

• In-depth understanding of IC fabricationprocesses, electroniccircuit analysis, and semiconductor physics

• Hands-on experience with FA related analytical tools

• Ability to build, train, and maintain AI models

• Experience working with global teams

You will also be eligible for Intern

What You'll Be Doing:

• Collaborate with technology leads, circuits and systems teams, VLSI physical design, and timing engineers to define and deploy the most sophisticated strategies of signing off timing in design for world-class silicon performance.
• Work on various aspects of STA, constraints, timing and power optimization.

What We Need to See:

• Pursuing BS or MS in Electrical or Computer Engineering.
• Understanding of CMOS circuit design in FinFET technology and mathematics/physics fundamentals of electrical design.
• Experience with 3DIC design flows and related technologies.
• Understanding of low power design techniques such as multi VT, Clock gating, Power gating, Block Activity Power, and Dynamic Voltage-Frequency Scaling (DVFS), CDC, signal/power integrity, etc.
• Understanding crosstalk, electro-migration, noise, OCV, timing margins. Familiarity with Clocking specs: jitter, IR drop, crosstalk, spice analysis.
• Experience with coding - TCL, Python – and familiarity with industry standard ASIC tools: PT, ICC, Redhawk, Tempus etc.

You will also be eligible for Intern

What you’ll be doing:

• Research and develop high performance applied AI internal CAD solutions for timing analysis and closure.

• Model Timing behavior of Silicon to push the boundary of silicon performance projection, Optimization and correlation.

• Work with Timing methodology teams to enable them test and deploy internal CAD solutions.

• Research ML and DL models as alternatives to analytical models to improve QoR of internal CAD solutions.

What we need to see:

• Currently enrolled and pursuing an MS or PhD in Electrical Engineering or related field.

• Experience in C++ and Python.

• Very familiar with STA EDA algorithms.

• Knowledge in digital circuit design.

• Exposure to ML, DL AI, Gen AI, and CUDA.

Ways to stand out from the crowd:

• Prior internship or professional CAD experience.

You will also be eligible for Intern

We, the

What you’ll be doing:

• Decompose research questions into smaller, more manageable parts and tackle them in iterative steps.

• Think critically to identify unseen gaps, and creatively bridge them with non-traditional, high-impact solutions.

• Connect with researchers and product engineers to ground research findings in real-world problems.

• Lead knowledge dissemination effort, with options for conference, journal, and in-house publication.

What we need to see:

• Currently pursuing a Ph.D. in the field of Computer Science/Engineering, Electrical Engineering, or related fields.

• Experience in gaming and/or human behavior in related application domains, demonstrated by one or more lead-author publications.

• Examples of public portfolios (e.g. repositories, OSS contributions, notebooks, packages, or technical blog posts with code).

• Proficiency with Python, Rust, and/or C++.

• Experience with AI model training and evaluation frameworks, like PyTorch.

• Comfortable with modern software development and version-control systems (e.g., GitHub/lab).

• Familiarity with and interest in modern deep learning models, including working with large-scale, multi-modal foundation models (such as recent LLMs, VLMs).

• Strong understanding of deep learning fundamentals and recent trends.

Ways to stand out from the crowd:

• Experience with multi-node, multi-GPU training and inference workflows.

• Proficiency in crafting, implementing, and conducting behavioral experiments involving human subjects and interactive visual stimuli.

• Experience with quantitatively modeling human perception, movement, and decision-making.

• A track record of applying human behavior models to machine learning applications.

You will also be eligible for Intern