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What you’ll be doing:
Develop methods, execute performance tests, and analyze data for IC components and board-level product certifications.
Participate in research and development of novel IC qualification processes.
Review and interpret equipment manuals, schematics, and technical documents to support equipment setup, calibration, and installation.
Assist engineers with analysis tasks, including equipment setup, sample preparation, basic thermal/power characterization, and troubleshooting of test equipment.
Support reliability lab operations by contributing to test requirement assessments, metrology design/optimization, and mechanical fixture assembly/debug.
Prepare and deliver project updates and lessons learned to the team.
What we need to see:
Currently pursuing a masters degree in Materials Science, Mechanical Engineering, or a related field.
Knowledge with IC packaging, reliability testing, and semiconductor technologies.
Knowledge withpackaging/test/failureanalysis lab equipment is a plus.
Knowledge of CAD/SolidWorks or similar design software is desirable.
Strong problem-solving skills, attention to detail, and ability to work both independently and collaboratively.
Excellent communication skills, with the ability to document and present technical findings clearly.
Ways to stand out from the crowd:
Knowledge in IC packaging and physics of failure
Experience in high power testing, such as Hipot, SIR, ECM
Experience in image processing
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Applications for this job will be accepted at least until November 17,2025.These jobs might be a good fit