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We need aSystem Fault Isolation Internwith expertise in physics, process andpackage technologies,
What you'll be doing:
Gain experience in debugging product failures at the die, package, component, and board level
Develop a working understanding of EFA and PFA techniques and tools including curvetracing, Electro-OpticalTerahertz Pulse Reflectometry (EOTPR), Vector Network Analyzer (VNA), Scanning Acoustic Microscopy (SAM), X-ray Computed Tomography (CT), Laser Voltage Probing (LVP),Optical/Electron/AtomicForce Microscopy, andUltra-thinning/delayeringand cross sectioning sample preparation techniques
Build knowledge surrounding the interactions between process technology, physical design, and circuit design
Develop innovations to help enhance the capability and efficiency of FA processes
What you need to have:
Pursuing a Bachelors or Masters degree in Electrical/Computer Engineering, Chemical Engineering, Materials Science/Engineering, Physics, or other related field
Lab experience with electrical and materials characterization tools
Experience in one or more areas across silicon process technology, VLSI design, and FA tools such as Curve Tracer, SEM, Lock-in Thermography, Pulse Reflectometry, LVP, etc.
Excellent communication skills and teamwork both cross-functionally and between companies
Ways to stand out from the crowd:
Practical experience in silicon technology and/or design
In-depth understanding of IC fabricationprocesses, electroniccircuit analysis, and semiconductor physics
Hands-on experience with FA related analytical tools
Ability to build, train, and maintain AI models
Experience working with global teams
You will also be eligible for Intern
Applications for this job will be accepted at least until November 17,2025.These jobs might be a good fit