Firmware Modeling Integration Engineering Manager jobs at Intel

Job Description:

• Lead and manage a team of silicon physical design engineers responsible for end-to-end silicon design engineering activities supporting technology development, and product design execution on EMIB 2.5D/3.5D, Foveros S/R/B, and Foveros Direct 3D Intel foundry advanced packaging technologies.

• Oversee planning, scheduling, and execution of design projects, ensuring milestones and deadlines are met.

• Drive continuous improvement in design methodologies, flows, and processes to enhance quality and efficiency.

• Collaborate with cross-functional teams (technology partners, packaging, analysis, and verification) to ensure seamless integration and manufacturability.

• Provide technical leadership and mentorship, fostering a culture of innovation and accountability.

• Responsible for enabling teams to execute through clear goal setting, facilitating work, maintaining accountability, applying differentiated performance management, and driving team results.

• Drives results by inspiring people, role modeling Intel values, developing the capabilities of others, and ensuring a productive work environment.

Key Responsibilities:

Leadership and Management

• Lead and manage a group of Silicon Packaging Engineers, providing guidance, mentorship, and support to ensure the successful execution of projects.

• Oversee the planning, scheduling, and execution of package design projects, ensuring that milestones and deadlines are met.

• Foster a collaborative and innovative team environment, encouraging continuous learning and professional development.

• Lead design groups, coordinating efforts across multiple teams to achieve project goals.

Technical Expertise

• Serve as the technical lead for the package design team cross multiple products.

• Drive the development of advanced packaging designs, ensuring compliance with industry standards and best practices.

• Collaborate with cross-functional teams, including package architects, silicon and board design teams, design rule owners, electrical analysis engineers, and integration teams to define and implement design specifications.

• Leverage extensive experience in advanced packaging designs to meet design KPIs.

• Influence.

• Ensure products are designed and developed with high quality standards by overseeing design processes, risk management, and compliance throughout the product design lifecycle, working closely with cross-functional teams to identify and address potential quality issues before they arise.

Project Management

• Develop and maintain detailed project plans, including resource allocation, risk management, and progress tracking.

• Coordinate with stakeholders to ensure alignment on project goals, deliverables, and timelines.

• Conduct regular project reviews and provide status updates to senior management.

Innovation and Improvement

• Identify and implement process improvements to enhance the efficiency and quality of package designs and development.

• Stay current with industry trends and emerging technologies, incorporating new methodologies and tools into the design process.

• Drive innovation in product design, exploring new approaches and techniques to achieve competitive advantages.

The ideal candidate should exhibit the following behavioral traits:

• Excellent leadership and team management skills, with the ability to inspire and motivate a diverse team of engineers.

• Strong project management skills, with the ability to manage multiple projects simultaneously and meet deadlines.

• Exceptional problem-solving and analytical skills, with a keen attention to detail.

• Excellent communication and interpersonal skills, with the ability to collaborate effectively with cross-functional teams and stakeholders.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

• Bachelor's degree in Electrical Engineeringor STEM related field with 9+years of relevant experience

• -OR- Master's degree in Electrical Engineeringor STEM related fieldwith 6+ years ofrelevant experience

• -OR- PhD in Electrical Engineeringor STEM related fieldwith 4+ years of relevant experience

Relevant experience should include the following:

• Experience in silicon design, with at least 3 years in a leadership role.

• Proven experience in a leadership or management role, with a track record of successfully leading engineering teams and delivering complex projects withinestablished timelines.

• Experience with design flows and methodologies (physical design, verification).

• Experience working with EDA tools from Cadence, Synopsys, and/or Siemens.

Preferred Qualifications:

• Experience with advanced nodes and packaging technologies

• Experience in RTL2GDS flows and methodologies

Experienced HireShift 1 (United States of America)US, Arizona, PhoenixUS, Oregon, Hillsboro
Position of Trust

Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

Annual Salary Range for jobs which could be performed in the US:

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

Responsibilities for this position include, but are not limited to:

• Appliesengineering/technical

• Applies advanced engineering knowledge of Intel and industry technology roadmaps, and technical knowledge of commodities to drive supply chain solutions ahead of Intel's needs.

• Develops supply chain solutions that are tailored to unique Intel development needs for complex situations and products.

• Leverages strong understanding of technology, contracting, negotiating, risk mitigation and supplier relationship management to manage supplier relationships, and provide sustainable cost, quality, availability, and technology solutions with adherence to procurement policies.

• Coordinates purchasing activities with cross-functional teams to acquire materials and services in a cost effective and timely manner.

• Ensures respective commodities meet technical specifications and cost requirements for Intel to develop products/services.

• Works closely with engineering teams and suppliers to define standard and custom product requirements, influences technical design decisions, negotiates technical contract terms with suppliers to meet technical specifications and fulfil business objectives.

• Conducts periodic reviews of commodity sourcing strategies in partnership with engineering teams/customers to shape strategic business objectives and account investments through aligned roadmaps.

• Reviews and pivots sourcing strategies in response to changing market conditions and develops mitigation plans to ensure business continuity.

• Works closely with finance and legal to resolve disputes with suppliers/internal partners.

• Leads sustainability and regularly compliance and ensures suppliers comply with Intel business processes.

• Understands Intel's technical roadmap and positions the supply chain to meet Intel's needs including alignment tosafety/availability/quality/sustainabilityframework.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

Bachelor’s degree in Engineering, Material Science, Supply Chain Management, or related field with 8+ years relevant experience

— or —

Master’s degree in the same fields with 6+ years of relevant experience

— or —

PhD in the same fields with 4+ years relevant experience

Relevant work experience should be of the following:

• Experience with Supply line and Capacity Management Planning

• Experience with Semiconductor substrate manufacturing, supplier capability analysis and capacity expansion requirements

• Experience with overall semiconductor packaging and advanced packaging requirements

Preferred Qualifications:

• Engineering experience in manufacturing and/or supplier management

• Experience in program management and setting technical recommendations and requirements

Experienced HireShift 1 (United States of America)US, Arizona, PhoenixUS, California, Santa Clara, US, Oregon, Hillsboro
Position of Trust

Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

Annual Salary Range for jobs which could be performed in the US:

Job Description:

Note: This role requires regular onsite presence to fulfill essential job responsibilities. Performs feasibility studies and provides integrated process solutions to meet desired safety, quality, reliability and output requirements for ultimate transfer to high volume manufacturing. Selects and develops material and equipment for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Plans and conducts experiments to fully characterize the process throughout the development cycle and to improve performance for each specific product. Identifies integrated process solutions to resolve issues or specific requests from customers by partnering with innovators in product engineering and module engineering teams. Conducts new product qualification and technology transfers from fabrication operations. Leverages big data analysis to identify process design weaknesses and/or manufacturing tool issues and proposes corrective, data-based solutions. Collaborates and engages with development and material suppliers, and partners to develop processes and equipment needs to meet technology roadmaps. As a principal engineer, recognized as a domain expert who influences and drives technical direction across Intel and industry. Develops and mentors other technical leaders, grows the community, acts as a change agent, and role models Intel values. Aligns organizational goals with technical vision, formulates technical strategy to deliver leadership solutions, and demonstrates a track record of relentless execution in bringing products and technologies to market.

Qualifications:

Bachelor's degree inElectrical/ElectronicEngineering, &/or Computer Engineering, or Science, or other STEM-related degree and 7 years of progressively related experience.

Alternatively, Master's degree inElectrical/ElectronicEngineering, &/or Computer Engineering, or Science, or other STEM-related degree and 5 years of progressively related experience.

Shift 1 (United States of America)US, Arizona, Phoenix
Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

Annual Salary Range for jobs which could be performed in the US:

Job Description:

As a Senior Principal Engineer, you will architect and develop embedded software that directly interfaces with hardware components, including microcode, IP-specific firmware, FPGAs, and DSPs. You will play a critical role in defining the firmware architecture, partitioning functionality between hardware and software, and driving co-validation strategies. This role requires deep technical expertise, strategic vision, and the ability to influence cross-functional teams across silicon, platform, and software domains.

Key Responsibilities:

• Firmware Architecture & Development
  • Design and implement embedded firmware with direct hardware interaction.
  • Define and partition features and algorithms between firmware and hardware for optimal performance, power, and scalability.
• Silicon & Platform Collaboration
  • Collaborate with silicon architects to define hardware requirements and influence architectural decisions.
  • Drive co-validation strategies across hardware and firmware to ensure seamless integration and functionality.
• Innovation & Pathfinding
  • Lead pathfinding efforts to explore emerging technologies and architectures.
  • Provide technical recommendations that shape future silicon and platform designs.
• Methodology & Process Improvement
  • Develop and refine methodologies, models, and tools to enhance firmware development and validation efficiency.
  • Champion best practices in embedded systems design and continuous improvement.
• Technical Leadership & Mentorship
  • Act as a domain expert and thought leader across the organization and industry.
  • Mentor and develop technical talent, fostering a culture of innovation and excellence.
  • Align organizational goals with technical strategy and drive execution from concept to product delivery.

Minimum Qualifications

• Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field.
• 10+ years as firmware architect/lead for either a data center product or technology

Preferred Qualifications:

• Technical mastery in at least 1-2 technical areas of a typical data center products
• Experience with defining (new) interfaces for multiple FW ingredients and microcontrollers

Experienced HireShift 1 (United States of America)US, Texas, Austin
Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

Annual Salary Range for jobs which could be performed in the US:

Job Description:

development engineers to drive technology development and enablementacross the full range of patterning modules for advanced CMOS technologies

be responsible fordevelopment and drivingmanufacturability across key lithography tools includingbut not limited to DUV

Primary responsibilities willat the intersection of technology developmenthigh volumeespecially on new lithography processesthat require engineering to meet high volume requirements.

This includes driving safety,quality, performance, throughput, capability (patternand cost.

high volumeand will be

and develop the engineer

The leader will be asubject matter expert and have experience working with Integration and othermodules leaders such as etch and thin films to deliver modular solutionsthat meet the technology targets.

Qualifications:

Minimum qualifications areto be initially considered for this position. Preferred qualifications are in addition to therequirements and are considered a plus factor inMinimum Qualifications:
14 years of relevant work experience in the semiconductor spacewith a strong focus on lithography
Degree in Electrical Engineering or Technical Equivalent
Prior senior management with large, multi-national manufacturing employers, preferably in hightechnology/scientific/semiconductorsectors with prior specialization in technology development.
Strong history of industry experience in process development, leadership, and semiconductor
Background working with a combination of investors and third- party suppliers on solutionoptimization/customizationto meet their manufacturing needsespecially with the industry leaders in lithography solutionssuch as ASML and KT.
Engineering group leader background at global scale including leading significant factory ramp-up and process technology development in high volume manufacturing environments.
Extensive experience instart-up with technicaltrack recordin multiple areas of semi-conductor sector in areas such as manufacturing engineering, quality and reliability, research and development, sourcing/supply chain innovations etc.Preferred Qualifications
Substantial technical background inlithography as used in advanced CMOS technologieswith a body of research and patents.Demonstrated history of delivering customized solutions in Research and Development and HVM organizations.related work experience in a semiconductor foundry preferredRequirements listed would be obtained through a combination of industry relevant job experience, internship

Experienced HireShift 1 (United States of America)US, Arizona, PhoenixUS, Oregon, Hillsboro
Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

Annual Salary Range for jobs which could be performed in the US:

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

Job Description:

Intel’s Foundry Technology and Manufacturing Automation organization is seeking anto drive the requirements, development, qualification, and deployment of factory automation capabilities for process, metrology, and material handling system equipment in Assembly factories. The nature of this work involves critical analysis in the implementation of hardware and software components, and problem-solving within the dynamics of an operating factory.

Responsibilities include but are not limited to:

• Conducting a technical capability gap analysis based on business drivers, product requirements definition, solution options analysis, Failure Mode Engineering Analysis (FMEA), and cost analysis.

• Managing solution development and deployment through the Software Product Life Cycle.

• Engaging with partner organizations, evaluating the feasibility of requirements, and determining priorities for development.

• Communicating priorities and status to stakeholders.

• Some supplier interaction and travel may be required, but it is rare. The successful candidate should exhibit the following behavioral traits:

• Semi-conductor engineering experience, or automation experience supporting a semi-conductor factory.

• Analytical and communication skills.

• Software Engineering skills.

• Troubleshooting skills.

• Project management skills.

• Ability to resolve issues with structured problem-solving, data collection, and analytical thinking.

• Candidates are expected to multi-task and work in a matrix team environment.

• Collaboration skills are essential as the candidate will need to collaborate with various partner groups to achieve goals and deliverables.

• Must be flexible and a self-starter.

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

• U.S. citizenship required.

• Ability to obtain and maintain US Government TS Security Clearance and SCI access.

• Bachelor of Science degree in any STEM field with 4+ years of relevant experience or a Master's degree in any STEM field with 3+ years of relevant experience or a Ph.D. in any STEM field with 1+ years of relevant experience.

• 3+ years of experience in managing software development projects or other engineering disciplines.

Preferred Qualifications:

• 3+ years of experience factory automation and control systems (Manufacturing Execution System, Shop Floor Control, etc.).

• Operational and Engineering analysis databases (e.g., Oracle, SQL Server, etc.).

• Semiconductor equipment automation/equipment integration. SEMI Equipment Automation Standards (E5, E30, E40, E94, E90, etc.).

Experienced HireShift 1 (United States of America)US, Arizona, Phoenix
Position of Trust

offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

Annual Salary Range for jobs which could be performed in the US:

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

You Are

Your responsibilities may include but not be limited to:

• SoC, clock design, and power delivery integration

• Drive performance optimization, including co-optimization work with process teams, to create best-in-class designs.

• Physical synthesis, place and route, and clock tree synthesis with Synopsys or Cadence tools.

• Static timing analysis constraint understanding and generation, clock stamping, and timing closure.

• Multiple Power Domain analysis using standard Power Formats UPF or CPF.

The ideal candidate will exhibit behavioral traits that indicate:

• Self-motivator with strong problem-solving skills

• Excellent interpersonal skills, including written and verbal communication

• Ability to work as part of a team and collaborate in a high-paced

Qualifications:

You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

• Bachelor’s Degree in Electrical Engineering, Computer Engineering or a related field with 6+ years of relevant experience -OR- Master’s Degree in Electrical Engineering, Computer Engineering or a related field with 4+ years of relevant

Preferred Qualifications

• 6+ years of experience in backend design and/or integration product development and delivery on leading edge process nodes

Experienced HireShift 1 (United States of America)US, Oregon, Hillsboro
Position of Trust

offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

Annual Salary Range for jobs which could be performed in the US:

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.