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Be responsible for identifying and researching component failures ofadvanced packagingtechnology to improve product yield, quality and/or reliability.
Evaluates the electrical and mechanical characteristics of integrated circuits, components, sub-components, and systems to determine the root cause of failure.
Analyses failure reports and recommends corrective action to prevent re-occurrence of problems.
Utilize and develop new application for all standard and advanced analytical equipment such as electronic test equipment and optical, laser microscope SEM/ FIB, FTIR, 2D, 3D X-ray, RIE, Chemicals BKM, CSAM/ CNC, Ion milling, sample prep and.
Supports new product transfer and start-up and the automation and improvement of the failure analysis process.
Strives to proliferate shared learning across sites.
Maintain to do silicon failure analysis and debugs necessary records and reports.
Performs other related duties as required or as directed.
Master's or a Bachelor's degree in Electrical, Electronics, or Microelectronics, or equivalent majors.
At least 2 years of experience in relevant field
Strong analytical and problem-solving skills, with proven ability to manage and engage stakeholders effectively.
Proficiency in English communication, both verbal and written
Additional qualifications include:
Ability to work well in a diverse team environment.
Good knowledge in one or more of these areas would be an added advantage: Device physics, I/O structure, Microprocessor architecture and micro architecture, microprocessor circuit, AI, etc.
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