Applied Materials Advanced Packaging Process Integration 

Singapore, Singapore 

975738802

Hsinchu,TWN, Singapore,SGP

Key Responsibilities:

• Collaborate with cross-functional teams including process, hardware, metrology, and sensing groups for enabling process integration efforts in advanced packaging modules
• Identify and solve high-value problems (HVPs) at both APDC and customer sites using FabVantage methodologies.
• Apply data analytics to diagnose process issues and optimize performance; leverage tools like JMP, FSS, and AIx databases.
• Support AGS sales initiatives by creating value opportunities for upsell and service contract expansion.
• Document findings, create technical reports, and present solutions to internal and external stakeholders.

Required Skills & Experience:

• Technical Expertise: Strong understanding of semiconductor backend and advanced packaging processes.
• Data Analytics: Proficient in statistical analysis, DOE, and data interpretation using JMP or similar tools; experience with AIx databases is a plus.
• Problem Solving: Demonstrated ability to troubleshoot complex process issues and drive root cause analysis.
• Communication: Clear and effective verbal and written communication skills.
• Collaboration: Proven experience working in cross-functional teams and customer-facing environments.

Qualifications:

• Bachelor’s or master’s degree in engineering, Materials Science, or related field.
• 4–7 years of experience in semiconductor or advanced packaging industries.
• Hands-on experience with advanced packaging process or/and backend process integration.
• Strong analytical mindset and data-driven approach to problem solving.
• Based in or willing to relocate to Singapore

Full time

Assignee / Regular