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Applied Materials Advanced Packaging Process Integration Singapore, Singapore 975738802
Today
Hsinchu,TWN, Singapore,SGP
Key Responsibilities:
- Collaborate with cross-functional teams including process, hardware, metrology, and sensing groups for enabling process integration efforts in advanced packaging modules
- Identify and solve high-value problems (HVPs) at both APDC and customer sites using FabVantage methodologies.
- Apply data analytics to diagnose process issues and optimize performance; leverage tools like JMP, FSS, and AIx databases.
- Support AGS sales initiatives by creating value opportunities for upsell and service contract expansion.
- Document findings, create technical reports, and present solutions to internal and external stakeholders.
Required Skills & Experience:
- Technical Expertise: Strong understanding of semiconductor backend and advanced packaging processes.
- Data Analytics: Proficient in statistical analysis, DOE, and data interpretation using JMP or similar tools; experience with AIx databases is a plus.
- Problem Solving: Demonstrated ability to troubleshoot complex process issues and drive root cause analysis.
- Communication: Clear and effective verbal and written communication skills.
- Collaboration: Proven experience working in cross-functional teams and customer-facing environments.
Qualifications:
- Bachelor’s or master’s degree in engineering, Materials Science, or related field.
- 4–7 years of experience in semiconductor or advanced packaging industries.
- Hands-on experience with advanced packaging process or/and backend process integration.
- Strong analytical mindset and data-driven approach to problem solving.
- Based in or willing to relocate to Singapore
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