Applied Materials Advanced Packaging Technology Process Integration Assistant Engineer 

Singapore, Singapore 

218421418

What We Offer

Responsibilities:

• Assisting engineer to work on developing assembly process technologies for advanced System-in-Package, RDL, Hybrid Bonding and Heterogeneous Packaging solutions

• Responsible for assisting in developing advanced 2.5D and 3D SiP MEOL and assembly flows

• Owner for execution of module process, data collection for measurement & inspection to validate each process in integration

• Interact with internal and external module process owners to align for tool time, execute process sequence and collect data to feedback to integration owner

• Occasional over-time to support process engineering activities

Requirements:

• ITE/ Diploma in Engineering or relevant studies

• Basic understanding on semiconductor process is preferred

• Experience on MEOL & Packaging Assembly unit Process (Reconstitution, Litho, Etch, CVD, PVD, Plating, Back Grinding, Dicing, Molding, P&P, Wire Bonding etc.) will be added advantages

• Candidates with minimum experiences are welcome to apply

Full time

Assignee / Regular