Expoint - all jobs in one place

The point where experts and best companies meet

Limitless High-tech career opportunities - Expoint

Nvidia Senior IC Packaging Engineer 
Taiwan, Taiwan Province, Hsinchu 
964391344

12.08.2024

What you will be doing:

  • Leading development of cutting-edge microelectronics packaging of Nvidia Networking Business Unit’s future products, evaluating NVIDIA products for reliability and performance.

  • Review manufacturability readiness at each milestone.

  • Work with world leading vendors to develop highly challenging packaging solutions.

  • Join and lead task forces to investigate and support production excursions, failure analysis and reliability issues and establish quality standards.

  • Monitor substrate and assembly production KPIs and collaborate with cross functional teams to define and monitor Yield Improvement Plans for continuous improvement and establish quality standards.

  • Lead process changes reviews, prepare and present data in Change Control Board meetings, lead technical reviews of product changes throughout the supply chain.

What we need to see:

  • Mechanical/Material Engineering degree, or any related equivalent experience.

  • 5+ years of relevant work experience in the semiconductor packaging industry, substrate manufacturing site or assembly site.

  • Basic design skills, such as using 2D ArtiosCAD, and 3D NX/SolidWorks/Creo applications.

  • Experience in DFM, understand tooling design, manufacturing processes, material properties and metrology tools.

  • High awareness for quality, robustness, and manufacturability.

  • High self-learning and self-motivation skills, fostering a culture of continuous learning, ongoing process improvement and proactive approach.

  • Leadership skills, capability to lead cross company projects that involve cross functional teams in different locations.

  • Curious and creative problem solver, well organized and multi-tasker.

  • Good English, verbal andwritten communicationskills.


Ways to stand out from the crowd:

  • Experience with mechanical CAD software (Solidworks, Spaceclaim).

  • Experience with development of mechanical FEA simulations using Ansys software.

  • Experience managing multiple packaging projects in cross-functional settings.

  • NPI processes leadership, including working with operations on manufacturing and quality.