Nvidia Senior IC Packaging Engineer 

Taiwan, Taiwan Province, Hsinchu 

964391344

What you will be doing:

• Leading development of cutting-edge microelectronics packaging of Nvidia Networking Business Unit’s future products, evaluating NVIDIA products for reliability and performance.

• Review manufacturability readiness at each milestone.

• Work with world leading vendors to develop highly challenging packaging solutions.

• Join and lead task forces to investigate and support production excursions, failure analysis and reliability issues and establish quality standards.

• Monitor substrate and assembly production KPIs and collaborate with cross functional teams to define and monitor Yield Improvement Plans for continuous improvement and establish quality standards.

• Lead process changes reviews, prepare and present data in Change Control Board meetings, lead technical reviews of product changes throughout the supply chain.

What we need to see:

• Mechanical/Material Engineering degree, or any related equivalent experience.

• 5+ years of relevant work experience in the semiconductor packaging industry, substrate manufacturing site or assembly site.

• Basic design skills, such as using 2D ArtiosCAD, and 3D NX/SolidWorks/Creo applications.

• Experience in DFM, understand tooling design, manufacturing processes, material properties and metrology tools.

• High awareness for quality, robustness, and manufacturability.

• High self-learning and self-motivation skills, fostering a culture of continuous learning, ongoing process improvement and proactive approach.

• Leadership skills, capability to lead cross company projects that involve cross functional teams in different locations.

• Curious and creative problem solver, well organized and multi-tasker.

• Good English, verbal andwritten communicationskills.

Ways to stand out from the crowd:

• Experience with mechanical CAD software (Solidworks, Spaceclaim).

• Experience with development of mechanical FEA simulations using Ansys software.

• Experience managing multiple packaging projects in cross-functional settings.

• NPI processes leadership, including working with operations on manufacturing and quality.