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Apple IC Packaging Engineer United States, California 614551101
01.06.2024
Key Qualifications
- We are looking for an individual with experience working in the Semiconductor Packaging field.
- Knowledge in materials characterization and analysis.
- Ideal candidate will have proven understanding of Wafer Level Packaging, 2.5D packaging and 3D packaging technology.
- General understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
- Excellent interpersonal skills and has strong business partnership building and collaboration with multi-functional teams and overseas suppliers.
- Ability to work independently and orchestrate projects with minimum supervision.
- Solution-oriented engineer who has proven fundamentals in engineering physics.
- Shown capabilities using package design softwares, APD, Virtuoso, etc.
- Confirmed understanding in memory packaging.
- Good program management skills.
- BS and 10+ years of relevant industry experience.
Education & Experience
BS and 10+ years of relevant industry experience. MS/PHD Preferred
Pay & Benefits
- At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $170,700 and $300,200, and your base pay will depend on your skills, qualifications, experience, and location.Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
Apple is an equal opportunity employer that is committed to inclusion and diversity. We take affirmative action to ensure equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics.
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