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Nova Application Scientist Team Lead 
United States, Oregon, Hillsboro 
908717992

06.08.2024

Why Nova:

  • Certified Best Places to Work from "Great Places to Work" in 2022 & 2023 (Rated by our employees) Top 30 in our industry category
  • Doubled in revenue from 2020 to 2022
  • Customer focus: We value building strong relationships. You'll be the face of Nova, working closely with customers to understand their needs.
  • Continuous learning: We're passionate about growth. You'll gain in-depth knowledge of cutting-edge metrology tools, participate in industry trainings, and receive ongoing mentorship from experienced engineers.

What will you do as an Application Team Lead?

  • Be a customer centric applications and product expert
  • Lead on site small team application scientist team on projects, daily activities and customer engagement.
  • Promote best known methods for Nova’s XPS/XRF and SIMS solutions
  • Able to manage, track and drive projects related to material metrology customer engagements.
  • Self-starter with high energy and strong work ethic
  • Highly collaborative and able to manage conflicts
  • Exceptional presentation, verbal skills to clearly articulate technical/analytical information
  • Be polite, cordial, considerate, and respectful when communicating with customers, vendors and fellow employees
  • Manage customer requests and requirements in a timely and professional manner
  • Mentor and coach less experience engineers
  • Train and update field applications engineers
  • Seek out opportunities to proliferate Nova’s metrology solutions
  • Perform strategic customer demonstrations of Nova solutions
  • Support development of new application features and assist in their market penetration
  • Assist end-users and Nova service engineers in troubleshooting Nova products in the field
Requirements
  • Degrees in Engineering, Physics, Material Science or relevant fields. Graduate degree preferred.
  • At least 7 years of experience in the semiconductor industry.
  • Demonstrated ability in leading projects in solving sophisticated technical problems.
  • Key areas of expertise include XPS/XRF, SIMS, metrology, and semiconductor processing.
  • Hands-on fab experience and strong background in semiconductor manufacturing processes (lithography, CMP, deposition, wet, dry etch and advanced packaging) preferred.
  • Demonstrated problem-solving skills and be able to work independently.
  • Excellent interpersonal and communication skills along with strong leadership skills are required.
  • Good work ethics with the highest degree of integrity and dignity
  • Must be fluent in English language, both writing and verbal communications
  • Be able to travel up to 25%, both domestic and international