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Apple IC Packaging Engineer United States, California, Cupertino 854258153
28.03.2024
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Key Qualifications
- We are looking for an individual with experience working in the Semiconductor Packaging field.
- Knowledge in materials characterization and analysis.
- Ideal candidate will have proven understanding of Wafer Level Packaging, 2.5D packaging and 3D packaging technology.
- General understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
- Excellent interpersonal skills and has strong business partnership building and collaboration with multi-functional teams and overseas suppliers.
- Ability to work independently and orchestrate projects with minimum supervision.
- Solution-oriented engineer who has proven fundamentals in engineering physics.
- Shown capabilities using package design softwares, APD, Virtuoso, etc.
- Confirmed understanding in memory packaging.
- Good program management skills.
- BS and 3+ years of relevant industry experience.
Education & Experience
- BS and 3+ years of relevant industry experience.
Pay & Benefits
- At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $138,900.00 and $256,500.00, and your base pay will depend on your skills, qualifications, experience, and location.Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
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