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Apple IC Packaging Integration Engineer United States, California, San Diego 990235890
28.03.2024
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Key Qualifications
- We are looking for someone experienced in the semiconductor packaging and/or system integration.
- Good understanding of multi-functional packaging areas: package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, FA and package-system integration
- Specialist in advanced packaging technologies: Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints
- Excellent problem solving with strong physics and fundamentals
- Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers
- Basic knowledge of signal integrity/power integrity
Description
-You will be responsible for IC packaging development-Work with cross-functional teams and lead SoC Package integration and architecture efforts-Drive the industry with advanced package solutions, new material developments, and specs
Education & Experience
-BS and 10+ years of experience in relevant industry experience
Pay & Benefits
- At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $161,700.00 and $284,900.00, and your base pay will depend on your skills, qualifications, experience, and location.Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
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