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Apple IC Packaging Simulation Engineer United States, California, Cupertino 757563734
18.05.2024
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Key Qualifications
- Proven capability in mechanics and mathematics.
- Hands-on experience of major FEM tools (e.g., ANSYS, ABAQUS, Hypermesh, etc.).
- Proficiency with numerical simulation software tools and expert in Matlab and/or Scientific Python.
- Deep understanding of packaging materials and their mechanical behaviors.
- Knowledge of electronic packaging structures and processes, as well as its reliability, and package qualification requirements is a huge plus.
- Able to perform independent research and development work.
- Excellent written and verbal communication skills with ability to present ideas, design concepts, data and plan with high confidence at team meetings.
Description
- Numerical modeling of the stress and deformation of component packages to provide comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability.- Programming CAD tools, FEM software, and numerical tools to set up automated model-generation user interfaces and maintain those codes.
Education & Experience
- BS and 3+ years of relevant industry experience.
Pay & Benefits
- At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $138,900.00 and $256,500.00, and your base pay will depend on your skills, qualifications, experience, and location.Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
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