10+ years of experience in Global Product Management, Business Management, and an Engineering background
Semiconductor background
MBA w/ BS or Masters in Engineering (ME, ChemE, EE, Materials, Etc.)
Valid US Passport: must be able to travel within North America, Asia, Europe (25% or more) and have customer facing meetings to influence technical and commercial buyers for service products and capabilities
Comfortable creating, communicating & presenting high level plans & results to internal executive partners that cover quarterly product, business and strategic reviews
Must have knowledge of Chemical Vapor Deposition (CVD) Semiconductor product positioning
Knowledge of improving CPW (Cost per Wafer) and COO (Cost of Ownership) through enhancing the equipment Wafer Output, Consumable and Non-Consumable Part Cost & Wafer Yield
Knowledge of creating multi-year customer facing roadmaps that continue to add Value (CIP – Continuous Improvement Programs)
Knowledge of how AI, sensor data & modeling can impact equipment performance & save equipment maintenance time and labor
Semiconductor Capital Equipment Service Business Knowledge is highly preferred
Key Responsibilities
Owns positioning and penetrating Service Product Development Programs
Aligns customers voice and high value problems with service products & capabilities
Creates valuable year over year roadmaps to achieve higher level of customer trust and satisfaction
Drives internal cross functional teams to deliver differentiated AIx, Preventative and Corrective Maintenance solutions that impact equipment uptime and improved on wafer results
Manages Sales and Business Development teams to create strategies and forecast service growth plans for the next 4 years
Owns service product penetration strategies, roadmaps and value delivery
Facilitates intercompany communication to align on product strategies, provide guidance on pricing, spare level contents, and restricted part orders. Facilitates alignment meeting for product roadmap and market proliferation
Leads coordination between various intercompany groups (such as Operations, Engineering and Global Product Management) to achieve year over year product improvements that impact wafer output, cost & yield
Functional Knowledge
Demonstrates comprehensive understanding of concepts and principles within own job family and knowledge of other related job families
Applies in-depth understanding of how own discipline integrates within thesegment/function
Leadership
Manages multiple related teams, sets organizational priorities and allocates resources
Problem Solving
Identifies and resolves complex technical, operational and organizational problems
Impact
Impacts the business results of a team or area by supporting and funding of projects, products, services and/or technologies and developing policies and plans
Guided by business unit, department or sub-functional business plans
Interpersonal Skills
Influences others internally and externally, including senior management