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* Design implementation and physical layout implementation of power grids, 2.5D and 3D die-die interconnects.
* DRC, LVS, and electrical checking.
* Ability to automate common processes and design steps.
* Development of high-speed signal interconnects working alongside SI and PI engineers.
* Electrical analysis and optimisation of ubump and RDL patterns.
* Evaluation and development of new 2.5D and 3D interconnect technologies.
* Technology and testchip roadmapping with a focus on advanced packaging.
Skills and Experience:
* Independent, self-starter who can work across a worldwide organization and customer base.
* Ability to manage multiple concurrent customers under short timelines.
* Comfort with providing guidance and direction with incomplete information.
* Experience with various IC, Package and PCB layout databases and tools.
* Strong TCL, Python scripting experience to automate routine tasks.
* Bachelor's degree in Electrical Engineering or Computer Science and 8+ years related work experience or a Master's degree in Electrical Engineering or Computer Science and 6+ years related work experience.
The annual base salary range for this position is $119,000 - $190,000.This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
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