Western Digital Staff Engineer Packaging Engineering SMT Material & Process 

Philippines, Baguio 

828332500

Today’s exceptional challenges require your unique skills. It’s You & Western Digital. Together, we’re the next BIG thing in data.

General Description:Defines IC package/SMT/SSD drive requirements, goals, and milestones for all SSD product groups and customer requirements. Develops SSD assembly and IC packaging material and processes to meet quality, reliability, cost, yield, productivity and manufacturing requirements. Develops new package and SMT process qualification programs. Prepares and/or updates specifications for piece parts of integrated circuits or semiconductor assemblies. Plans and conducts experiments to fully characterize material and processes throughout pathfinding to development to ramp. Develops solutions to improve quality, reliability, cost, yield, process stability/capability, productivity, and safety utilizing formal education, experience, statistical knowledge, and problem-solving tools. Establishes process control systems. Transfers process to high volume manufacturing and provide support in new factory start-up. Acts as a liaison with suppliers/vendors. Maintains product quality while developing and introducing package cost reduction programs. Coordinates the introduction of new package processes into production. Using appropriate tools, performs integrity analysis of packages.

PME Specific Role Description :Includes the following but not limited to:

· SMT material and process development

· SMT integration development

· SMT technology (material/process/metrology/equipment) pathfinding & roadmap

· Stencil design/development for new components

· DFM assessment and NUDD risk management

· Component-board-drive interactions

· DOE & Failure Analysis knowledge

· Quality Tools: FMEA, 8D, DMAIC, IPC knowledge etc.

· Statistical Tools: Statistical analysis (JMP/Minitab), GreenBelt/BlackBelt certification

· Special engineering characterization & improvement projects

· Factory emergency taskforce support

Requirements:The PTDI team embodies a high performance culture, marked by highly analytical, attention-to-details, hyper-productive, highly hands-on individuals. They work together to solve difficult problems. They are innovative. They possess the elusive “complete ownership” characteristic and have strong engineering pride, always willing to go above and beyond.

• Bachelor/Master/PhD engineering/material/science required plus min 10 years of relevant work experience, min 5 year for PhD. Relevant work experience must be in engineering role within semiconductor industry. Academic studies must be in applicable field of engineering/science and demonstrate an academic record of excellence
• Demonstrated track record to pathfinding and development new SMT material such as paste and epoxy with vendors and utilizing test methodology to qualify new material in factory.
• Demonstrated track record to rapidly analyze and solve complex engineering issues by pursuing a focused solution path with a clear understanding of technical fundamental on root causing thru failure analysis report (EDX/FTIR etc), simulation report, mechanical (shadow moire) analysis report, or any relevant metrology data collection.
• Demonstrated track record working hands-on around technical equipment and processes (including metrology and semiconductor failure analysis techniques)
• Proficient in statistical analysis towards problem solving and the use of Minitab or JMP and Excel
• Demonstrated track record to summarize complex data sets for technical and non-technical audiences; elegant in DOE design and execution
• Highly self-motivated and self-directed with demonstrated ability to work well with people; have strong inter-cultural intuition
• Proven success leading technical team(s) in previous work experience
• Strong verbal and written communications skills