Western Digital Staff Engineer Packaging Engineering 

Philippines, Baguio 

141205767

But we can’t do it alone. Today’s exceptional data challenges require your exceptional skills. It’s You & Us. Together, we’re the next big thing in data.

Specific Role Description: Includes the following but not limited to:

• Involving in SSD mechanical assembly process and integration development within NPI program which process setup, process improvement, yield management and overall mass production readiness.
• Commonality analysis by product design/process/machine/material/measurement, facilitate collaboration among various teams to conduct Root Cause Corrective Action (RCCA) effectively.
• Perform engineering DOEs and apply statistical analysis method for problem solving/decision making.
• Conducting factory DFMA check for SSD drive assembly thru Design Package (design concept, tolerance stack up analysis, DFMEA, etc) and involve in machines/fixtures design for process enabling.
• Involving in Product qualification package (such as product specification, packaging, mechanical drawing, supplier DFM, QMP, etc) for each qualifies product during development phase.
• Involving in special engineering characterization activities, cost reduction projects and factory emergency taskforce support.

Requirements:PTDI team embodies a high-performance culture, marked by highly analytical, attention-to-details, hyper-productive, highly hands-on individuals. They work together to solve difficult problems. They are innovative. They possess the elusive “complete ownership” characteristic and have strong engineering pride, always willing to go above and beyond.

• Bachelor’s degree in mechanical engineering or related disciplines. Academic studies must be in applicable field of engineering/science and demonstrate an academic record of excellence.
• Candidate with 5-7 years working experience in engineering role within semiconductor industry. Experience in automation, product design, process characterization will be added advantage.
• Demonstrated track record to rapidly analyze and solve complex engineering issues in creative manner by a clear understanding of the point of diminishing returns.
• Demonstrated track record to summarize complex design/data sets for technical and non-technical audiences, elegant in DOE design and execution.
• Demonstrated track record working hands-on around technical equipment and processes (including metrology and failure analysis techniques)
• Highly self-motivated and self-directed with demonstrated ability to work well with people; have strong inter-cultural intuition.
• Proficient in Quality tools (FMEA, 8D, DMAIC, etc) and Statistical tools (JMP, Minitab).
• Understanding common material commodity used in semiconductor industry such as metal, plastic, rubber & adhesive will be added advantage.
• Understanding the making process / tooling construction of the mechanical commodity which not limited to CNC milling, stamping, bending, injection molding, die casting and extrusion will be added advantage.
• Proficient in Solidwork CAD software. Knowledge with Solidwork Flow Simulation will be added advantage.
• Strong verbal and written communications skills