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Today’s exceptional challenges require your unique skills. It’s You & Western Digital. Together, we’re the next BIG thing in data.
General Description:Defines IC package/SMT/SSD drive requirements, goals, and milestones for all SSD product groups and customer requirements. Develops SSD assembly and IC packaging material and processes to meet quality, reliability, cost, yield, productivity and manufacturing requirements. Develops new package and SMT process qualification programs. Prepares and/or updates specifications for piece parts of integrated circuits or semiconductor assemblies. Plans and conducts experiments to fully characterize material and processes throughout pathfinding to development to ramp. Develops solutions to improve quality, reliability, cost, yield, process stability/capability, productivity, and safety utilizing formal education, experience, statistical knowledge, and problem-solving tools. Establishes process control systems. Transfers process to high volume manufacturing and provide support in new factory start-up. Acts as a liaison with suppliers/vendors. Maintains product quality while developing and introducing package cost reduction programs. Coordinates the introduction of new package processes into production. Using appropriate tools, performs integrity analysis of packages.
PME Specific Role Description :Includes the following but not limited to:
· SMT material and process development
· SMT integration development
· SMT technology (material/process/metrology/equipment) pathfinding & roadmap
· Stencil design/development for new components
· DFM assessment and NUDD risk management
· Component-board-drive interactions
· DOE & Failure Analysis knowledge
· Quality Tools: FMEA, 8D, DMAIC, IPC knowledge etc.
· Statistical Tools: Statistical analysis (JMP/Minitab), GreenBelt/BlackBelt certification
· Special engineering characterization & improvement projects
· Factory emergency taskforce support
Requirements:The PTDI team embodies a high performance culture, marked by highly analytical, attention-to-details, hyper-productive, highly hands-on individuals. They work together to solve difficult problems. They are innovative. They possess the elusive “complete ownership” characteristic and have strong engineering pride, always willing to go above and beyond.
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