IBM Defect Inspection Yield Engineer 

United States, New York, City of Albany 

744659520

• Experience in Microelectronics field (2+ years)
• Ability to independently troubleshoot and solve complex problems
• Experience with data analysis and presenting to technical audience
• Demonstrated understanding of Yield Characterization
• Understanding of optical and eBeam inspection techniques
• Experience in Far Back End of Line (FBEOL) / 3D Integration / Chip Packaging (2+ years)
• Experience with data analysis and presenting to technical audience (2+ years)
• Experience using optical and eBeam inspection equipment (2+ years)