Cisco Failure Analysis Component Engineer 

Taiwan, Taipei, Taipei 

712736602

Department: Supply Chain Operations – Component Quality and Technology, GSM

As a subject matter expert, you will lead deep-dive FA investigations, drive corrective actions with suppliers, and enable component quality and reliability for Cisco products ranging from switches and routers to servers and AI platforms. The role requires strong knowledge of SERDES-based ICs, DDRx/HBMx memory, x86/ARM SoCs, and storage components, as well as hands-on proficiency in electrical and physical failure analysis..

• Lead technical investigations for component failures across NPI, mass production, and field return stages.
• Perform root cause analysis on high-speed interfaces including PCIe, Ethernet SERDES, DDR4/5, LPDDRx, HBMx, and NVMe/SATA/SAS components.
• Work closely with Cisco’s global teams and contract manufacturers to debug system-level failures involving SoCs (x86/ARM), power delivery, and signal integrity.
• Understand use of advanced FA techniques such as curve tracing, X-ray, CSAM, OBRICH, SEM/EDX, FIB, and microprobing. Be able to understand when to apply what techniques and tools for targeted failure analysis in collaboration with FA labs and suppliers.
• Collaborate with suppliers to define and verify corrective actions (8D, RC/CA reports).
• As a component subject-matter expert, provide guidance to FA leads at Cisco CMs..
• Participate in cross-functional reviews of component quality and reliability issues, technology and design reviews, yield excursions, and drive solutions to resolve failures.
• Create and deliver clear FA reports and executive summaries with risk assessments and mitigation paths with excellent attention to details.
• Support lab expansion or qualification and audits across regional test partners.

• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Physics, or related discipline.
• 5+ Experience in semiconductor quality, with knowledge in design, fabrication, characterization, qualification, testing, quality, reliability, failure analysis.
• Strong technical background in analyzing and common failure modes impacting high-speed interfaces and ICs such as NPU ASICs, FPGA/CPLDs, SERDES-based PHYs, DRAM (DDRx/LPDDR), and storage (SATA, PCIe NVMe) architectures.
• Deep understanding of FA tools and workflows (CSAM, SEM, X-ray, FIB, OBIRCH, etc.) and structured problem solving methods such as Fishbone, and 3x5 Whys, etc.
• Experience working with contract manufacturers, ODMs, and semiconductor vendors in Taiwan or Asia.
• Familiarity with JEDEC, IPC, and industry qualification standards.
• Excellent written and verbal communication skills in English.
• Ability to work independently, drive issues to closure, and influence cross-functional teams.