Microsoft Senior Director Hardware Engineer 

United States, Texas, Austin 

423163844

ing leadersand industry knowledge to envision and implement future technical solutions that will manage andthe Cloud infrastructure.

Required/Minimum Qualifications

• 11+ years of related technical engineering experience
  • OR Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience or internship experience
  • OR Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience or internship experience
  • OR Doctorate degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 5+ years technical engineering experience.
• 10+ years of experience in Product development and manufacturing in large scale and/or high performance (i.e., AI, machine leaning, neural nets, CPU’s) and/or high power SoCs/chips.
• 10+ years of experience in Developing Integrated Circuits (pre-silicon, first silicon bring-up, new product introduction).
• 8+ years of experience in product and test engineering, specializing in ATE test program development.

Other Requirements

• to meet Microsoft, customer and/or government security screening requirementsarerequiredfor this role. These requirements include but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will berequiredto pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.

Preferred Qualifications

• Lead by effectively managing external vendors, guiding cross-functional teams, and overseeing sub-projects within larger development programs.
• The position requires experience in semiconductor IC development, IC manufacturing, fabrication, testing, and packaging.
• They should alsohave excellent knowledge ofmanufacturingdevelopmentacross foundry, packaging integration, assembly, test, characterization, debug, and yielddisciplines.
• The candidate should also haveknowledgeofdesign and pre-silicon developmentandwhat isrequiredto ensure manufacturabilityto deliver ahigh volumeramp-DFT,testcoverage,quality/reliability.
• The candidate wouldbenefitfrom a background in various product market areas such as high-performance computing, AI, GPUs, CPUs.
• Overall product engineering role taking product from definition to launch.
• Experience inplatformengineering, gatheringcustomer requirements andshaping solutionsthattake full advantage ofin-housesilicondevelopment.
• Deep understanding ofSi configuration (SKU) management, platform dependencies andsupplier/customer interfacing
• Electrical Engineering and/or Device physics background.

• Expertise in Silicon ingredients, with a focus on evaluation and selection tied to platform architecture decisions

• Industry competitive analysis to drive cost effective product

Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here:

Microsoft will accept applications for the role until December 2, 2024.

• Drive next generation manufacturing development roadmaps to enabledevelopment, manufacturing, fabrication, testing, and packaging ofHyperscalerclasssemiconductor integrated circuits (ICs).
• Work with diverse and talented set of engineering teams to develop the vision for next generation ofHyperscalerclasssemiconductor integrated circuits (ICs)and how to make them manufacturable with industry leading product cost to provide best in class platform cost of ownership.
• Driveeco system partnerships to enablepre-Siand post-Sireadiness for power, performance, Thermal and Power delivery relatedtestingforindustry bestplatform solutions – differentiating features that will provide cost and performance advantage.
• Establish and growexternal vendorrelationships, drive cross functional teams and drive projects as part of larger development programs.
• Haveexcellent knowledgeof silicon development life cycle across foundry, packaging integration,assemblyandtesttechnologies with ability to cultivate industry partnerships to drive outcomes.
• Conduct industry competitive analysis to identify opportunities for developing cost-effective products.