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We are seeking an experienced Foundry Interface Engineer with deep expertise in working with foundry partners, process and yield optimization, and statistical analysis. This engineer will drive continuous improvement in process definition, collaborate with cross-functional teams, and conduct in-depth investigations into quality, reliability, and yield performance. As a Foundry Interface Engineer, you will work closely with internal design, product, and manufacturing teams, as well as external foundry partners, to optimize process technology and ensure the successful delivery of high-quality silicon. You will leverage your technical expertise to address process and yield challenges, manage PDK (Process Design Kit) collateral deployment, and negotiate optimal process solutions.Our final product is a consumer electronics device, not just the silicon, so you will stretch beyond traditional foundry engineering boundaries and tackle system-level challenges, offering ample opportunities to learn system architecture.Key job responsibilities- Manage PDK collateral and ensure its seamless deployment in design environments.
- Perform in-depth technical analysis, including electrical and physical failure analysis (eFA/pFA) and statistical failure analysis, to identify root causes and implement corrective and preventive actions.
- Support design teams with PDKs, IP development, tapeout, and implementation of DFM (Design for Manufacturing) and design-for-reliability requirements.
- Provide technical leadership in adopting new technologies and methodologies to enhance product performance, reliability, and cost-efficiency.
- PhD/Master's degree in Electrical Engineering or a related field.
- 10+ years of experience in semiconductor process development and manufacturing.
- 5+ years of experience in foundry management or technology evaluation within the fabless semiconductor model, including custom process and library development.
- Extensive knowledge of device physics, foundry design collateral management, process qualification, fabrication processes, device reliability, statistical analysis, yield improvement, and physical failure analysis techniques.
- Proven problem-solving and decision-making skills in electrical/physical (eFA/pFA) and statistical failure analysis. Hands-on experience with SPICE and layout tools and a solid understanding of advanced packaging technology.
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