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Cisco PIC Design Engineer 
United States, New Jersey 
181609300

05.08.2024

Acacia Communications designs intelligent transceivers using advanced signal processing and photonic integration for the 100G, 400G and 1T bit speed fiber optic transmission market deployed in data center, metro, long-haul and ultra-long haul telecommunication networks.

What you'll do:

As a member of the Photonic Integrated Circuits (PIC) team, you will be a key member of a small, dynamic group that develops advanced photonics chips for optical communications products. You will design, simulate, layout and test PIC's.

You will design, and numerically model passive, and active photonic components with tools such as FDTD, HFSS and COMSOL. You will also perform script-based GDS layout of photonic components, circuits and full product chips.

Who you’ll work with:

You will work very closely with the entire PIC team covering a wide variety of directions, including silicon photonics and III-V device designs, simulation, foundry process development, production tapeouts, PIC testing, and production support. You will also work closely with millimeter wave design team, packaging team, and module hardware / software / optics testing team in building complete products.

Who you are:

You have deep knowledge of PIC design, simulation, layout, fabrication, and testing needed for pioneering high-volume products. This includes hands on knowledge of optical waveguides, modulators, photodetectors, and other passive & active optical components.

Minimum requirements:
  • Ph.D. with 5+ years of experience or master’s degree with 10+ years of industry experience or equivalent in optical engineering, physics, electrical engineering.
  • 5+ years of photonic IC design experience in industry.
  • 5+ years of experience with photonics numerical simulation principle and tools.
  • 5+ years of script-based component GDS layout and tapeout.
  • 5+ years of experience in photonic component testing.
Preferred Requirements:
  • Experience with GDS level mask data for device fabrication
  • Experience with high-speed probing
  • Prior interaction with wafer foundries to optimize PIC designs and associated fabrication techniques
Accepting applications until August 15, 2025

We tackle whatever challenges come our way. We have each other’s backs, we recognize our accomplishments, and we grow together. We celebrate and support one another – from big and small things in life to big career moments. And giving back is in our DNA (we get 10 days off each year to do just that).