Amazon Principal IC Package & Assembly Technology 

Israel, Haifa District, Haifa 

103670775

We offer a dynamic, open, teamwork environment operating at high pace mode.Key job responsibilities
- Evaluation of packaging and assembly technology roadmap aligned to Annapurna product roadmap– Explore and provide recommendations on both available and future packaging and assembly technologies for Annapurna’s products.
– Engage with substrate and assembly vendors on future technologies roadmap.
• Product development and manufacturing:– Assume full ownership of mechanical and thermal performance of Annapurna ICs.
– Work with Assembly, Test and Logistics to define work flows at OSATs (focus on Fab/assembly/test interfaces)
– Track assembly and substrate yields and look for ways to improve them.About the team
Diverse Experiences
AWS values diverse experiences. Even if you do not meet all of the qualifications and skills listed in the job description, we encourage candidates to apply. If your career is just starting, hasn’t followed a traditional path, or includes alternative experiences, don’t let it stop you from applying.
Why AWS?Inclusive Team CultureMentorship & Career Growth
We’re continuously raising our performance bar as we strive to become Earth’s Best Employer. That’s why you’ll find endless knowledge-sharing, mentorship and other career-advancing resources here to help you develop into a better-rounded professional.
Work/Life Balance

• 10+ years of professional experience in similar role.
• B.Sc. or M.Sc. degree in Electrical Engineering, Applied Physics or related fields.

• High communication skills
• Dive deep quickly into unfamiliar domains
• Strong analytic and problem-solving skills
• Ability to work independently on multiple issues.