Intel DSS Collateral Device Engineer 

China, Liaoning, Dalian 

514142913

Qualifications

Minimum Qualifications:

Candidate must possess a PhD or Masters degree with experience in a relevant field such as Electrical Engineering, Materials Science and Engineering, Chemical Engineering, Physics or other similar technical degree.

Preferred Qualifications: Experience in the following: Logic process integration or device engineering Param analysis, report, NAND process integration engineering. Familiar with process characterization, qualification, troubleshooting and probe yield improvement Familiar with characterization techniques such as SEM, TEM, EDX, SIMS etc. Statistical design of experiments, SPC, PCS methodology, data analysis skills and experience with JMP, SQL PF, Python, Catalyst etc. In-depth knowledge of device physics, parametric test structures, and probe sort data. Familiar with CAD tools and software for test structure layout review Hands-on experiences in technology development, technology transfer and/or technology startup. Strong commitment in work and flexible in working time

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing BenefitsThis role will require an on-site presence.