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Beol Back-end-of-line Integration Principal Engineer jobs at Intel in Taiwan, Hsinchu
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Taiwan
Hsinchu
10 jobs found
20.11.2024
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Intel Senior NAND Product Engineer Taiwan, Taiwan Province, Hsinchu
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Develop burn-in and high speed I/O test specs, methodologies, and validation plans for NAND flash memory components. Work closely with test development engineers to validate and deploy test flows on...
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23.06.2024
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Intel Global Yield Device Integration Engineer Taiwan, Taiwan Province, Hsinchu
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This job requisition is to seek a Principal Engineer in the Device Integration team in the FSM HVM Global Yield organization, reporting to the Director of Device Integration Engineering. The...
23.06.2024
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Intel Global Yield FEOL Front-End-Of-Line Process Taiwan, Taiwan Province, Hsinchu
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Bachelor’s degree in science and engineering major, with at least 15-18 years of experience. Experience in advanced node semiconductor industry in FEOL Process Integration (preferably in one (or more) of...
22.06.2024
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Intel Global Yield BEOL Senior Process Integration Development Eng... Taiwan, Taiwan Province, Hsinchu
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Own engineering projects to execute HVM yield roadmap, device targeting and attain performance targets. Collaborate with Technology Development and Local Yield teams to import new technology to production fabs. Work...
22.06.2024
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Intel Yield Analysis Engineer Taiwan, Taiwan Province, Hsinchu
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Bachelor's degree in science and engineering major. 10+ years' experience in advanced node semiconductor industry in in yield analysis and data science. Level of experience will be considered in determining...
22.06.2024
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Intel Global Yield FEOL Front-End-Of-Line Process Taiwan, Taiwan Province, Hsinchu
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Description:Full job details
Own engineering projects to execute HVM yield roadmap, device targeting and attain performance targets. Collaborate with Technology Development and Local Yield teams to import new technology to production fabs. Work...
22.06.2024
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Intel Product Packaging Engineer Intern Taiwan, Taiwan Province, Hsinchu
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Intel advanced packaging technology pathfinding project management. Integration of packaging processes/designs/simulation/test/reliability/Failure Analysis(FA) according to Intel biz process. With a valid in-school student status. Currently in 3rd/4thyear of college or 2ndyear...
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Description:Full job details
Develop burn-in and high speed I/O test specs, methodologies, and validation plans for NAND flash memory components. Work closely with test development engineers to validate and deploy test flows on...
These jobs might be a good fit
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