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Intel Product Packaging Engineer Intern Taiwan, Taiwan Province, Hsinchu 561347797
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Responsibilities may be quite diverse of a technical nature.
Intel advanced packaging technology pathfinding project management
Integration of packaging processes/designs/simulation/test/reliability/Failure Analysis(FA) according to Intel biz process
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.Minimum Qualifications:
With a valid in-school student status
Currently in 3rd/4thyear of college or 2ndyear of graduate students are recommended
Preferred Qualifications:
The candidate must be an active student currently pursuing degrees/master/PHD in Material science , physics, chemical/electronic/electrical/mechanical engineering
Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits
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