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IBM
IBM Research Hardware Developer Advisory professional United States, New York, City of Albany
Required Technical and Professional Expertise1) More than 5 years experience with 3D flip chip assembly, reliability testing, and failure analysis,2) Basic understanding of wafer level packaging/assembly processes, laminate, reliability test,...
Required Technical and Professional Expertise1) More than 8 years experience with 3D flip chip assembly, reliability testing, and failure analysis,2) Basic understanding of wafer level packaging/assembly processes, laminate, reliability test,...
Developing and utilizing AI frameworks such as PyTorch and TensorFlow in enterprise level applications. Working with IBM’s research team to develop next generation solutions for IBMs Telum series of on-chip...
Your Role and The job role is thermal hardware developer, responsibilities include creating thermal simulations of electronic assemblies, lab experiments to test concept, prototype, and finished assemblies, presenting results of...
Preferred Technical and Professional Expertise1) Hands on experience in semiconductor 3D packaging technology,2) Experience of flip chip assembly process (TCB, reflow), laminate technology, packaging reliability test, failure analysis, and semiconductor...
Willingness to complete the requirements of the apprenticeship program. Some knowledge or experience in ONE or more of the following:Java, JavaScript, PHP, C#, Objective-C, C/C++, Python, Ruby and/or functional languages...
Participate in design, implementation, integration, and verification of virtualization functions. Execute unit test plans and functional tests to verify high quality code deliverables. Perform code reviews with other members of...
Required Technical and Professional Expertise1) More than 5 years experience with 3D flip chip assembly, reliability testing, and failure analysis,2) Basic understanding of wafer level packaging/assembly processes, laminate, reliability test,...
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